Communication-Defect-Free Direct Bonding for High-Performance Glass-On-LiNbO3 Devices

被引：9

作者：

Xu, Jikai ^{[1
]}

Wang, Chenxi ^{[1
]}

Wu, Bin ^{[1
]}

Tian, Yanhong ^{[1
]}

Qi, Xiaoyun ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2018年 / 165卷 / 14期

基金：

中国国家自然科学基金; 中国博士后科学基金;

关键词：

SILICON;

D O I：

10.1149/2.0871814jes

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Fabrication of glass-on-LiNbO3 structure by bonding technology is indispensable for acoustic micro/nanofluidic and photonic devices. However, direct bonding of LiNbO3 and glass is very difficult to realize because there is an extremely large thermal expansion mismatch between these two materials. This work realized a cost-effective bonding approach without requiring intermediate layer after annealing at 150 degrees C via vacuum ultraviolet (VUV)/O-3 activation. A defect-free bonding interface was observed by highresolution transmission electron microscopy (HRTEM). The LiNbO3/glass bonded pairs exhibited excellent optical transmittance and these results overcome the interfacial barrier of glass-on-LiNbO3 structures for high-performance devices. (c) 2018 The Electrochemical Society.

引用

页码：B727 / B729

页数：3

共 12 条

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