Symmetrical "Sandwich" Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength

被引:26
作者
Zhang, Xuan [1 ]
Zhang, Yang [1 ]
Zhou, Qian [1 ]
Zhang, Xianlong [1 ]
Guo, Shaoyun [1 ]
机构
[1] Sichuan Univ, Polymer Res Inst, Chengdu, Peoples R China
基金
中国国家自然科学基金;
关键词
POLYPROPYLENE; COPPER; RESIN;
D O I
10.1021/acs.iecr.9b05676
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
To solve film formation and creep of nonvulcanized polybutadiene liquid rubber, it was designed and fabricated as a thermosetting, transferable, and symmetrical "sandwich" structure adhesive film through solution coating processing. The adhesive failure evolved from an independent cohesive failure or interfacial failure to a randomly staggered interfacial failure. According to the molecular dynamic simulation, compared to the molecular structure of 1,4-polybutadiene, the isolated pi electron cloud of the vinyl side chain of 1,2-polybutadiene can form "chemical-like bonding" with the outer electrons of copper atoms. Meanwhile, the peel strength of the surface-modified polybutadiene adhesive (28.16 N/25 mm) was about three times that of the untreated one (10.11 N/25 mm), and its dielectric properties (epsilon' = 2.416 and tan delta = 0.0026) maintained an ultralow level at 10 GHz, which was mainly decided by the electronic and atomic polarization of vinyl. This strategy was helpful to develop a processing method for the adhesive film of nonvulcanized liquid rubber and apply to high-speed signal transmission.
引用
收藏
页码:1142 / 1150
页数:9
相关论文
共 24 条
[1]   Adhesion of polymers [J].
Awaja, Firas ;
Gilbert, Michael ;
Kelly, Georgina ;
Fox, Bronwyn ;
Pigram, Paul J. .
PROGRESS IN POLYMER SCIENCE, 2009, 34 (09) :948-968
[2]   Improvement of adhesion properties of polypropylene substrates by methyl methacrylate UV photografting surface treatment [J].
Balart, J. ;
Fombuena, V. ;
Espana, J. M. ;
Sanchez-Nacher, L. ;
Balart, R. .
MATERIALS & DESIGN, 2012, 33 :1-10
[3]  
Banerjee P. K., 2017, P AM SOC COMP TECH C, V2, P840
[4]   Adhesive properties of epoxy resin modified by end-functionalized liquid polybutadiene [J].
Barcia, FL ;
Soares, BG ;
Sampaio, E .
JOURNAL OF APPLIED POLYMER SCIENCE, 2004, 93 (05) :2370-2378
[5]   Evaluation of a PECVD advanced barrier (k=3.7) for 32 nm CMOS technology and below [J].
Chapelon, L. L. ;
Petitprez, E. ;
Brun, P. ;
Farcy, A. ;
Torres, J. .
MICROELECTRONIC ENGINEERING, 2007, 84 (11) :2624-2628
[6]   Design and Preparation of Benzoxazine Resin with High-Frequency Low Dielectric Constants and Ultralow Dielectric Losses [J].
Chen, Jiangbing ;
Zeng, Ming ;
Feng, Zijian ;
Pang, Tao ;
Huang, Yiwan ;
Xu, Qingyu .
ACS APPLIED POLYMER MATERIALS, 2019, 1 (04) :625-630
[7]  
Ho P., 2011, Low Dielectric Constant Materials for IC Applications, P1, DOI [10.1007/978-3-642-55908-2_1, DOI 10.1007/978-3-642-55908-2_1]
[8]   Correlation of residual stress and adhesion on copper by the effect of chemical structure of polyimides for copper-clad laminates [J].
Jang, Wonbong ;
Seo, Minbum ;
Seo, Jongchul ;
Park, Sunggook ;
Han, Haksoo .
POLYMER INTERNATIONAL, 2008, 57 (02) :350-358
[9]   A smart adhesive joint: Entropic control of adhesion at a polymer/metal interface [J].
Khongtong, S ;
Ferguson, GS .
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2002, 124 (25) :7254-7255
[10]   Tuning the dielectric and energy storage properties of polystyrene-based polymer dielectric by manipulating dipoles and their polarizing behavior [J].
Li, Qizheng ;
Liu, Jingjing ;
Zhang, Xiao ;
Tan, Shaobo ;
Lu, Junyong ;
Zhang, Zhicheng .
PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2019, 21 (28) :15712-15724