Grain refinement mechanism at high undercooling of Ni80Cu20 alloy

被引：10

作者：

Ma, Kai ^{[1
]}

Zhao, Yuhong ^{[1
]}

Xu, Xiaolong ^{[1
,2
]}

Hou, Hua ^{[1
]}

机构：

[1] North Univ China, Coll Mat Sci & Engn, Taiyuan 030051, Shanxi, Peoples R China

[2] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Shaanxi, Peoples R China

来源：

MATERIALS RESEARCH EXPRESS | 2019年 / 6卷 / 04期

基金：

中国国家自然科学基金;

关键词：

undercooling; quenching; annealing; recrystallization; RAPID SOLIDIFICATION; NONEQUILIBRIUM SOLIDIFICATION; RECRYSTALLIZATION; MICROSTRUCTURE; LIQUID;

D O I：

10.1088/2053-1591/aaeee9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The mechanism of grain refinement at large undercooling was systematically studied. Maximum undercooling of about 300 K of Ni80Cu20 alloy was achieved using molten glass purification and cyclic superheating methods. The recrystallization mechanism of grain refinement at large undercooling was verified by means of quenching and annealing. Quenching before recalescence with Ga-In-Sn liquid alloy, the microstructure of the quenched Ni80Cu20 alloy consisted of equiaxed grains and fine dendrites, which were obviously partially recrystallized microstructures. Annealing the quenched alloy, dendrites fragments were replaced by the equiaxed grains result from recrystallization. At the same time, the increase of high angle grain boundaries and Sigma 3 twins boundaries, the reduction of texture intensity and hardness further verified the recrystallization mechanism of grain refinement at high undercooling regime.

引用

页数：9

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