In-situ observation of bulk 3D grain evolution during plastic deformation in polycrystalline Cu

被引:87
作者
Pokharel, Reeju [1 ,3 ]
Lind, Jonathan [1 ,2 ]
Li, Shiu Fai [2 ]
Kenesei, Peter [4 ]
Lebensohn, Ricardo A. [3 ]
Suter, Robert M. [1 ]
Rollett, Anthony D. [1 ]
机构
[1] Carnegie Mellon Univ, Pittsburgh, PA 15213 USA
[2] Lawrence Livermore Natl Lab, Livermore, CA 94550 USA
[3] Los Alamos Natl Lab, Mat Sci & Technol Div, Los Alamos, NM 87544 USA
[4] Argonne Natl Lab, Adv Photon Source, Argonne, IL 60439 USA
基金
美国国家科学基金会;
关键词
Microstructures; Crystal plasticity; Polycrystalline material; Non-destructive evaluation; High-energy X-ray diffraction microscopy; X-RAY-DIFFRACTION; ELECTRON BACKSCATTER DIFFRACTION; TEXTURE EVOLUTION; ELASTIC STRAINS; PART; ORIENTATION; MICROSCOPY; COPPER; RECRYSTALLIZATION; MICROSTRUCTURE;
D O I
10.1016/j.ijplas.2014.10.013
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
We present a non-destructive in-situ measurement of three-dimensional (3D) microstructure evolution of 99.995% pure polycrystalline copper during tensile loading using synchrotron radiation. Spatially resolved three-dimensional crystallographic orientation fields are reconstructed from the measured diffraction data obtained from a near-field high-energy X-ray diffraction microscopy (nf-HEDM), and the evolution of about 5000 3D bulk grains is tracked through multiple stages of deformation. Spatially resolved observation of macroscopic texture change, anisotropic deformation development, and the correspondence of different crystallographic parameters to defect accumulation are illustrated. Moreover, correlations between different crystallographic parameters, such as crystal rotation evolution, short- and long-range orientation gradient development, microstructural features, and grain size effects are investigated. The current state of data mining tools available to analyze large and complicated diffraction data is presented and challenges associated with extracting meaningful information from these datasets are discussed. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:217 / 234
页数:18
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