Abrasive Particles Trajectory Analysis and Simulation of Cluster Magnetorheological Effect Plane Polishing

被引：22

作者：

Pan, Jisheng ^{[1
]}

Yan, Qiusheng ^{[1
]}

Xu, Xipeng ^{[2
]}

Zhu, Jiangting ^{[1
]}

Wu, Zhancheng ^{[1
]}

Bai, Zhenwei ^{[1
]}

机构：

[1] Guangdong Univ Technol, Fac Electromech Engn, Guangzhou 510006, Guangdong, Peoples R China

[2] Huaqiao Univ, Engn Res Ctr Brittle Mat Machining, Xiamen 361201, Peoples R China

来源：

INTERNATIONAL CONFERENCE ON SOLID STATE DEVICES AND MATERIALS SCIENCE | 2012年 / 25卷

关键词：

Cluster MR effect; Plane polishing; Abrasive particles trajectory; Simulation;

D O I：

10.1016/j.phpro.2012.03.067

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Kinematics model of abrasive particles for certain eccentric and linear interpolation swing uncertain eccentric, uncertain eccentricity of X direction and Y direction in plane polishing based on cluster magnetorheological(MR) effect are built and simulated by computer, and also obtain the influence law of key factors such as the speed ratio r of polishing disk and workpiece, the eccentricity e to polishing disk, the distance of abrasive particles P to the center of polishing disk, the ratio F of swing range A and swing speed V to polish quality. At last, polishing experiment for single crystal 6H-SiC is carried out on the experiment equipment of the cluster MR effect by selecting optimized parameters through the simulation results, which verified the correctness of the simulation results. (C) 2012 Published by Elsevier B.V. Selection and/or peer-review under responsibility of Garry Lee

引用

页码：176 / 184

页数：9

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