Analysis of a process for replication of electroforming molds with integral microscreens

被引:1
作者
Pitchumani, R [1 ]
Jiang, Q [1 ]
Morales, AM [1 ]
Domeier, LA [1 ]
机构
[1] Univ Connecticut, Dept Mech Engn, Storrs, CT 06269 USA
来源
MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY IX | 2004年 / 5342卷
关键词
LIGA; microfabrication; injection molding; fluid flow analysis; heat transfer; PMMA; replication; microdevices;
D O I
10.1117/12.530761
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A process for the rapid replication of electroforming plastic micromolds has been developed at Sandia National Laboratories, Livermore, CA. The process is based on injection molding of plastic replicates with integral metallic screens to produce sacrificial electroforming molds in which the metallic screen acts as the conducting base and the plastic features provide insulating sidewalls. The process consists of injecting molten PMMA via a center-gate into a disk-shaped mold cavity in which a sandwich of a flow channel plate, porous Nickel foam, and metallic microscreen are placed on top of the LIGA-fabricated tooling. A numerical model for the coupled heat transfer and fluid flow phenomena is used to investigate the effects of various process parameters on the mold-filling behavior. The results from the parametric studies are presented and discussed.
引用
收藏
页码:156 / 164
页数:9
相关论文
共 12 条
[1]  
Bird R B., 2002, Transportphenomena
[2]  
Domeier LA, 2002, MICROSYST TECHNOL, V8, P78, DOI [10.1007/s00542-001-0135-9, 10.1007/S00542-001-0135-9]
[3]  
DOMEIER LA, 2002, Patent No. 6422528
[4]   Materials of LIGA technology [J].
Ehrfeld, W ;
Hessel, V ;
Löwe, H ;
Schulz, C ;
Weber, L .
MICROSYSTEM TECHNOLOGIES, 1999, 5 (03) :105-112
[5]  
*FLUENT INC, 2001, FLUENT 6 0 MAN
[6]  
GHICA V, 1982, Patent No. 30398110
[7]  
Heiber C. A., 1987, INJECTION COMPRESSIO, P1
[8]   VOLUME OF FLUID (VOF) METHOD FOR THE DYNAMICS OF FREE BOUNDARIES [J].
HIRT, CW ;
NICHOLS, BD .
JOURNAL OF COMPUTATIONAL PHYSICS, 1981, 39 (01) :201-225
[9]   LIGA technologies and applications [J].
Hruby, J .
MRS BULLETIN, 2001, 26 (04) :337-340
[10]   Hot embossing in microfabrication. Part II: Rheological characterization and process analysis [J].
Juang, YJ ;
Lee, LJ ;
Koelling, KW .
POLYMER ENGINEERING AND SCIENCE, 2002, 42 (03) :551-566