Study on the evolution of interfacial (Cu,Ni)6Sn 5 and shear property of (111)Cu/Sn/Ni micro joints under isothermal and TG-bonding

被引：11

作者：

Lai, Yanqing ^{[1
]}

Zhao, Ning ^{[1
]}

机构：

[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China

来源：

INTERMETALLICS | 2022年 / 147卷

基金：

中国国家自然科学基金;

关键词：

Advanced packaging; Cu -Ni cross-Interaction; (111)Cu; Temperature gradient; Full intermetallic joint; SOLDER JOINTS; MICROSTRUCTURE EVOLUTION; CROSS-INTERACTION; UNIDIRECTIONAL GROWTH; MECHANICAL STRENGTH; GRAIN MORPHOLOGY; NI/SN/CU SYSTEM; CU6SN5; GRAINS; CU; SN;

D O I：

10.1016/j.intermet.2022.107614

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Single-crystal Cu can be potentially applied as pad or micro bump in bonding technology for advanced packaging. A novel bonding method with an extra temperature gradient (TG, TG-bonding) was carried out to bonding single-crystal (111)Cu and poly-crystal Ni substrates with Sn as interlayer. The morphology and orientation evolution, elemental distribution and growth kinetics of interfacial (Cu,Ni)6Sn5 intermetallic compound (IMC) in (111)Cu/Sn/Ni micro joints during isothermal and TG-bonding were investigated. Regular roof-type (Cu,Ni)6Sn5 grains along three intersectant directions with an angle of 60 degrees formed at the initial Sn/(111)Cu interface and maintained the roof-type morphology with (1120) preferred orientation throughout the isothermal bonding. For TG-bonding, TG-induced atomic thermomigration (TM) and Cu-Ni cross-interaction co-played a critical role in the morphology, grain feature and growth kinetics of the interfacial IMCs. Moreover, rapid growth of (Cu,Ni)6Sn5 phase was achieved by TG-bonding with (111)Cu as hot end to fabricate full IMC joints which had higher shear strength than the cases of isothermal and TG-bonding with (111)Cu as cold end. The proposed method would provide a further insight for developing bonding technology for advanced packaging.

引用

页数：10

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