Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

被引:361
作者
Oh, Hyunseok [1 ]
Han, Bongtae [1 ,2 ]
McCluskey, Patrick [1 ]
Han, Changwoon [3 ]
Youn, Byeng D. [4 ]
机构
[1] Univ Maryland, Dept Mech Engn, College Pk, MD 20742 USA
[2] Sungkyunkwan Univ, Dept Mech Engn, Suwon 440746, South Korea
[3] Korea Elect Technol Inst, Components & Mat Phys Res Ctr, Songnam 463816, South Korea
[4] Seoul Natl Univ, Dept Mech & Aerosp Engn, Seoul 151742, South Korea
关键词
Condition monitoring (CM); insulated gate bipolar transistor (IGBT); physics-of-failure (PoF); prognostics; POWER ELECTRONIC DEVICES; IGBT MODULES; AL WIRE; RELIABILITY ASSESSMENT; HEALTH MANAGEMENT; SUPER-JUNCTION; SOLDER JOINTS; CYCLING TEST; TURN-ON; TEMPERATURE;
D O I
10.1109/TPEL.2014.2346485
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recent growth of the insulated gate bipolar transistor (IGBT) module market has been driven largely by the increasing demand for an efficient way to control and distribute power in the field of renewable energy, hybrid/electric vehicles, and industrial equipment. For safety-critical and mission-critical applications, the reliability of IGBT modules is still a concern. Understanding the physics-of-failure of IGBT modules has been critical to the development of effective condition monitoring (CM) techniques as well as reliable prognostic methods. This review paper attempts to summarize past developments and recent advances in the area of CM and prognostics for IGBT modules. The improvement in material, fabrication, and structure is described. The CM techniques and prognostic methods proposed in the literature are presented. This paper concludes with recommendations for future research topics in the CM and prognostics areas.
引用
收藏
页码:2413 / 2426
页数:14
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