共 18 条
[1]
THETA-JC CHARACTERIZATION OF CHIP PACKAGES - JUSTIFICATION, LIMITATIONS, AND FUTURE
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1989, 12 (04)
:724-731
[2]
Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-D systems
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2001, 24 (04)
:566-590
[3]
Analytical multipoint moment matching reduction of distributed thermal networks
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2004, 27 (01)
:87-95
[5]
GHAUSI MS, 1968, INTRO DISTRIBUTED PA
[6]
LASANCE C, 1999, P SEMI THERM 15, V1, P1
[7]
LASANCE C, 1995, P SEMI THERM 9, V1, P1
[8]
THEORY OF NONUNIFORM RC LINES .I. ANALYTIC PROPERTIES AND REALIZABILITY CONDITIONS IN FREQUENCY DOMAIN
[J].
IEEE TRANSACTIONS ON CIRCUIT THEORY,
1967, CT14 (01)
:2-&
[9]
Dynamic thermal multiport modeling of IC packages
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2001, 24 (04)
:596-604
[10]
Measuring partial thermal resistances in heat-flow path
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2002, 25 (04)
:547-553