Carbon nanotubes as interconnects: Emerging technology and potential reliability issues

被引：3
作者：
Thompson, Carl V. [1 ]
机构：
[1] MIT, Microsyst Technol Lab, Dept Mat Sci & Engn, Cambridge, MA 02139 USA
来源：
2008 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 46TH ANNUAL | 2008年
关键词：
D O I：
10.1109/RELPHY.2008.4558914
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The use of carbon nanotubcs (CNTs) to replace or complement Cu-based IC interconnects is under wide-spread investigation. CNTs have low resistivities and can be configured to have low capacitive coupling, and are also chemically stable so that diffusion barriers are not needed. They can also carry very high current densities without damage. Properties and processing of CNTs for IC interconnects are reviewed and emerging technologies and possible reliability issues are discussed.
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收藏
页码：368 / 376
页数：9
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