Microstructural characterization and recrystallization kinetics of cold rolled copper

被引：20

作者：

Benchabane, Ghania ^{[1
]}

Boumerzoug, Zakaria ^{[2
]}

Gloriant, Thierry ^{[3
]}

Thibon, Isabelle ^{[3
]}

机构：

[1] Univ Mohamed Khider Biskra, Dept Mat Sci, Biskra 07000, Algeria

[2] Univ Mohamed Khider Biskra, Dept Genie Mecan, Biskra 07000, Algeria

[3] UMR CNRS 6226 SCR Chim Met, INSA Rennes, F-35043 Rennes, France

来源：

PHYSICA B-CONDENSED MATTER | 2011年 / 406卷 / 10期

关键词：

Copper; Recrystallization kinetics; Cold rolling; DSC; Twins; EBSD; DIFFERENTIAL SCANNING CALORIMETRY; VARIOUSLY TEXTURED COPPER; ACTIVATION-ENERGY; DISTRIBUTIONS; METALS;

D O I：

10.1016/j.physb.2011.02.068

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

The recrystallization kinetics in pure copper deformed by cold rolling is mainly investigated by differential scanning calorimetry (DSC) under non-isothermal conditions. DSC curves show exothermic peaks corresponding to the stored energy released during recrystallization process. Variation of the heating rate and application of different methods allowed us to calculate two kinetic parameters of recrystallization: (i) the activation energy of the process was calculated using three different methods and (ii) the Avrami exponent was estimated using the Matusita method. On other hand, the microstructural evolution during recrystallization and grain growth of cold rolled copper were investigated at a temperature of 450 degrees C by scanning electron microscopy (SEM) and electron back scattered diffraction (EBSD). (C) 2011 Elsevier B. V. All rights reserved.

引用

页码：1973 / 1976

页数：4

共 22 条

[1]

[Anonymous], 2002, ANAL ANAL CHEM, DOI DOI 10.1021/AC60131A045

[2] Annealing twin formation and recrystallization study of cold-drawn copper wires from EBSD measurements [J].

Baudin, T. ;

Etter, A. L. ;

Penelle, R. .

MATERIALS CHARACTERIZATION, 2007, 58 (10) :947-952

[3] Recrystallization of pure copper investigated by calorimetry and microhardness [J].

Benchabane, G. ;

Boumerzoug, Z. ;

Thibon, I. ;

Gloriant, T. .

MATERIALS CHARACTERIZATION, 2008, 59 (10) :1425-1428

[4] ON THE CALCULATION OF ACTIVATION-ENERGIES USING A MODIFIED KISSINGER METHOD [J].

BOSWELL, PG .

JOURNAL OF THERMAL ANALYSIS, 1980, 18 (02) :353-358

[5] Grain boundary engineering and the role of the interfacial plane [J].

Davies, P ;

Randle, V .

MATERIALS SCIENCE AND TECHNOLOGY, 2001, 17 (06) :615-626

[6] Activation energy determination for recrystallization in electroplated-copper films using differential scanning calorimetry [J].

Donthu, SK ;

Vora, MM ;

Lahiri, SK ;

Thompson, CV ;

Yi, S .

JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (06) :531-534

[7] Triple junction and grain boundary character distributions in metallic materials [J].

Fortier, P ;

Miller, WA ;

Aust, KT .

ACTA MATERIALIA, 1997, 45 (08) :3459-3467

[8]

GERBER P, 2002, THESIS U PARIS 13 VI

[9] INITIAL-STAGES OF RECRYSTALLIZATION IN ALUMINUM CONTAINING BOTH LARGE AND SMALL PARTICLES [J].

HANSEN, N ;

BAY, B .

ACTA METALLURGICA, 1981, 29 (01) :65-77

[10] ON THE KINETICS OF RECRYSTALLIZATION IN COLD-WORKED METALS [J].

HUTCHINSON, B ;

JONSSON, S ;

RYDE, L .

SCRIPTA METALLURGICA, 1989, 23 (05) :671-676

← 1 2 3 →