Effect of ultrasonic field on grain refinement and stress relaxation of Be films by thermal evaporation

被引:4
作者
Luo, Bingchi [1 ,2 ]
He, Yudan [1 ]
Li, Kai [1 ,2 ]
Jin, Lei [1 ]
Li, Bo [1 ]
Luo, Jiangshan [1 ]
机构
[1] China Acad Engn Phys, Res Ctr Laser Fus, Mianyang 621900, Sichuan, Peoples R China
[2] Sci & Technol Plasma Phys Lab, Mianyang 621900, Sichuan, Peoples R China
来源
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2020年 / 253卷
基金
中国国家自然科学基金;
关键词
Beryllium film; Ultrasonic vibration; Grain refinement; Residual stress; ELECTRICAL-RESISTIVITY; RESIDUAL-STRESS; ALLOY; MICROSTRUCTURE; GROWTH; COATINGS; SURFACE; UPDATE;
D O I
10.1016/j.mseb.2019.114436
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The beryllium (Be) films were prepared by vacuum evaporation with ultrasound on the glass slide substrates. The Be coating mainly consists of a-Be phase independent of ultrasonic vibration, while the texture and crystallinity are affected by ultrasonic vibration. With the increasing of ultrasonic power, the surface displays polygonal grains, but the grain size decreases from 130 nm to 60 nm. The cross section views show a transition from regular columnar structure to broken columnar structure owing to the ultrasonic mechanical agitation. When ultrasonic vibration is applied, the microstructure transforms from isolated islands to bicontinuous islands in the initial stage of film growth. In addition, the residual stress of Be films changes from a tensile stress to compressive stress under the effect of ultrasonic vibration, which is closely related to the transformation of microstructure.
引用
收藏
页数:6
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