A HONEYCOMB MICRO CHANNEL COOLING SYSTEM FOR ELECTRONICS COOLING

A honeycomb porous micro channel cooling system for cooling of electronic chips is proposed in this paper. The design, fabrication, test system configuration of the micro channel heat sink is summarized. Preliminary experimental investigation is conducted to determine the heat transfer characteristics and cooling performance under steady single-phase flow of water liquid. In the experiments, the brass micro channel heat sink is attached to a test heater with 8cm(2) area, the experimental results show that the cooling system can effectively remove the heat flux of 18.2W/cm(2) under 2.4W pumping power, while the junction-wall temperature is 48.3 degrees C at the room temperature of 26 degrees C. The experimental results show that the present cooing system has good performance.