A HONEYCOMB MICRO CHANNEL COOLING SYSTEM FOR ELECTRONICS COOLING

被引：0
作者：
Luo, Xiaobing [1 ]
Liu, Yonglu [1 ]
Liu, Wei [1 ]
机构：
[1] Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430074, Peoples R China
来源：
ICNMM 2009, PTS A-B | 2009年
关键词：
Honeycomb; Micro channel; Electronics cooling;
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
A honeycomb porous micro channel cooling system for cooling of electronic chips is proposed in this paper. The design, fabrication, test system configuration of the micro channel heat sink is summarized. Preliminary experimental investigation is conducted to determine the heat transfer characteristics and cooling performance under steady single-phase flow of water liquid. In the experiments, the brass micro channel heat sink is attached to a test heater with 8cm(2) area, the experimental results show that the cooling system can effectively remove the heat flux of 18.2W/cm(2) under 2.4W pumping power, while the junction-wall temperature is 48.3 degrees C at the room temperature of 26 degrees C. The experimental results show that the present cooing system has good performance.
引用
收藏
页码：261 / 265
页数：5
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