Ultra wide frequency band ceramic package and assembly technology

被引：0

作者：

Tsuldyama, Y ^{[1
]}

Shiobara, M ^{[1
]}

Osakada, A ^{[1
]}

Hashimoto, M ^{[1
]}

机构：

[1] Sumitomo Met Ind Ltd, Corp Res & Dev Labs, Amagasaki, Hyogo 6600891, Japan

来源：

CERAMIC INTERCONNECT TECHNOLOGY: NEXT GENERATION | 2003年 / 5231卷

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Ultra wide frequency band ceramic feed-thru, which transmits the whole frequency band of DC-65 GHz, has been developed by optimizing the configuration of ground via holes, in the conventional process of multilayered alumina ceramics. Smaller spacing between each raw of the ground via holes on either side of the signal strip makes cut-off frequency higher but ground via holes farther from signal via hole make return loss smaller. Furthermore, by applying this design to our LTCC package, the package has had much better RF performance of less than -15dB return loss and more than -0.5dB insertion loss in the whole frequency band of DC-84GHz. Leads are attached to the outside I/O terminals so that package can be assembled onto PWB very easily. This package has had high RF transmission performance of DC-50GHz, even after assembled onto PWB. These newly developed packages are already tested for 40Gbps modulator drivers and 60GHz W-LAN amplifiers.

引用

页码：43 / 46

页数：4