High-speed and high-density chip-to-chip interconnections: Trends and techniques

被引：7
|
作者：
Schmatz, ML [1 ]
机构：
[1] IBM Corp, Zurich Res Lab, Res, CH-8803 Ruschlikon, Switzerland
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2000年
关键词：
D O I：
10.1109/EPEP.2000.895484
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：23 / 24
页数：2
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