Pixel level packaging for uncooled IRFPA

被引：5

作者：

Dumont, G. ^{[1
]}

Rabaud, W. ^{[1
]}

Baillin, X. ^{[1
]}

Pornin, J. L. ^{[1
]}

Carle, L. ^{[1
]}

Goudon, V. ^{[1
]}

Vialle, C. ^{[1
]}

Pellat, M. ^{[1
]}

Arnaud, A. ^{[1
]}

机构：

[1] CEA LETI, MINATEC, F-38054 Grenoble 9, France

来源：

INFRARED TECHNOLOGY AND APPLICATIONS XXXVII | 2011年 / 8012卷

关键词：

IRFPA; Micro-bolometer; pixel level packaging; low cost; thin film getters;

D O I：

10.1117/12.883852

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

As packaging represents a significant part of uncooled IR detectors price, a collective packaging process would contribute to enlarge uncooled IRFPA application to very low cost camera market. Since the first proof of the pixel level packaging for uncooled IRFPA in 2008, CEA-LETI is still strongly involved in the development of an innovative packaging technology. This one aims at encapsulating each pixel under vacuum in the direct continuity of the bolometer process. Moreover, a thin film getter has been developed to be integrated in the micropackaging so as to increase the packaging lifespan. This paper presents the recent development at CEA-LETI of this pixel level packaging technology including getter integration and vacuum level measurements.

引用

页数：7