Analysis of On-Chip Digital Noise Coupling Path for Wireless Communication IC Test Chip

被引:0
作者
Tanaka, Satoshi [1 ]
Fan, Peng [1 ]
Ma, Jingyan [1 ]
Aoki, Hanae [1 ]
Yamaguchi, Masahiro [1 ]
Nagata, Makoto [2 ]
Muroga, Sho [3 ]
机构
[1] Tohoku Univ, Dept Elect Engn, Sendai, Miyagi, Japan
[2] Kobe Univ, Grad Sch Syst Informat, Kobe, Hyogo, Japan
[3] Toyota Coll, Natl Inst Technol, Dept Elect & Elect Engn, Toyota, Japan
来源
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits | 2015年
关键词
wireless communication; RF IC; digital noise; magnetic thin film; noise suppressor; conduction noise; FILMS; ANISOTROPY;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In-band spurious tones of a LTE-class radio frequency integrated circuit (RFIC) receiver test element group (TEG) chip was studied in order to evaluate the degree of noise suppression by means of soft magnetic thin film. A 2-mu m-thick crossed anisotropy multilayered Co-Zr-Nb film was appllied onto the passivation layer of TEG chip. The in-band spurious was suppressed by 10 dB while it had no influence upon wanted signal. A magnetic near field map measured in the 2.1 GHz range indicated several noise coupling paths on chip, which were compared with the chip layout design to estimate victim wires. EM simulation model in connection with circuit simulation is carefully constructed. RF control wirings were most responsible wires than other wires and air couplings. EM simulation predicted the magnetic film should suppress noise by the maximum of 33 dB while it was 10 dB experimentally because of Si substrate coupling and board coupling.
引用
收藏
页码:216 / 221
页数:6
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