Microstructure and Thermal Cycle Reliability of Sn-Ag-Cu-In-Sb Solder Joint

被引：4

作者：

Hirai, Yukihiko ^{[1
,2
]}

Oomori, Kouki ^{[2
]}

Morofushi, Hayato ^{[2
]}

Sarayama, Masaaki ^{[2
]}

Iioka, Makoto ^{[1
]}

Shohji, Ikuo ^{[1
]}

机构：

[1] Gunma Univ, Fac Sci & Technol, Div Mech Sci & Technol, Kiryu, Gumma 3768515, Japan

[2] Hitachi Astemo Ltd, Mat Technol Dev Dept, Hitachi, Tochigi 3291233, Japan

来源：

MATERIALS TRANSACTIONS | 2022年 / 63卷 / 07期

关键词：

lead-free solder; solder joint; tin-silver-copper indium antimony; microstructure; crystal orientation; thermal cycle test; thermal fatigue life; BI;

D O I：

10.2320/matertrans.MT-MC2022013

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, the microstructure and the thermal fatigue life of Sn-3.0 mass%Ag-0.5 mass%Cu-6.0 mass%In-1.0 mass%Sb (SAC305-6In-1Sb) were investigated and they were compared with those of Sn-3.0 mass%Ag-0.5 mass%Cu (SAC305). As the test pieces, chip resistors were joined on a printed wiring board by reflow soldering with each solder. Although precipitates of Ag and Cu were present in both solder joints, the precipitation state and size of Ag precipitates were different for each solder joint. In the solder joint with SAC305-6In-1Sb, the precipitate of In and Sb was also confirmed. In addition, In and Sb were solid-soluted in Sn. Solder joints with SAC305-6In-1Sb were polycrystal with approximately 20 crystal grains per cross section of the joint. On the other hand, the joint of SAC305 was consisted of a single crystal. Average of thermal fracture life of SAC305-6In-1Sb was approximately 4.3 times longer than that of SAC305. In addition, the variation in the life of SAC305-6In -1Sb was smaller.

引用

页码：1021 / 1027

页数：7

共 17 条

[1] Intermetallic compounds in 3D integrated circuits technology: a brief review [J].

Annuar, Syahira ;

Mahmoodian, Reza ;

Hamdi, Mohd ;

Tu, King-Ning .

SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2017, 18 (01) :693-703

[2] Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints [J].

Belyakov, S. A. ;

Xian, J. ;

Zeng, G. ;

Sweatman, K. ;

Nishimura, T. ;

Akaiwa, T. ;

Gourlay, C. M. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (01) :378-390

[3] Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In [J].

El-Daly, A. A. ;

Hammad, A. E. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2011, 509 (34) :8554-8560

[4]

Han C, 2006, EL PACKAG TECH CONF, P781

[5] Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu [J].

Han, Changwoon ;

Han, Bongtae .

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2014, 28 (03) :879-886

[6]

Hine K, 2017, T JAPAN I ELECT PACK, V10

[7]

Hirai Yukihiko, 2021, Materials Science Forum, V1016, P553, DOI 10.4028/www.scientific.net/MSF.1016.553

[8] Effect of Bi Addition on Tensile Properties of Sn-Ag-Cu Solder at Low Temperature [J].

Hirai, Yukihiko ;

Oomori, Kouki ;

Morofushi, Hayato ;

Shohji, Ikuo .

MATERIALS TRANSACTIONS, 2019, 60 (06) :909-914

[9] Influence of Crystallographic Orientation on Fatigue Reliability of β-Sn and β-Sn Micro-Joint [J].

Kariya, Yoshiharu ;

Tajima, Sho ;

Yamada, Saori .

MATERIALS TRANSACTIONS, 2012, 53 (12) :2067-2071

[10]

Kumar P. Manoj, 2018, Powder Metallurgy Progress, V18, P49, DOI 10.1515/pmp-2018-0006

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