FeFETs for Near-Memory and In-Memory Compute

被引:11
作者
Salahuddin, Saveef [1 ]
Tan, Ava [1 ]
Cheema, Suraj [2 ]
Shanker, Nirmaan [1 ]
Hoffmann, Michael [1 ]
Bae, J-H [1 ]
机构
[1] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
[2] Univ Calif Berkeley, Dept Mat Sci & Engn, Berkeley, CA 94720 USA
来源
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2021年
关键词
D O I
10.1109/IEDM19574.2021.9720622
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Ferroelectric Field Effect Transistors (FeFETs), where a ferroelectric material is placed on the gate of a transistor has seen resurgence in the recent years with the advent of doped HfO2 as a ferroelectric material [1]. Here we will discuss the potential and challenges for FeFETs as a memory solution for near-memory and in-memory computing. The ability to integrate the ferroelectric oxide on high-performance Si channels means that fast READ speed is achievable. In addition, recent demonstrations have shown that HfO2 based Ferroelectrics scale down to very small footprint area, which should enable achieving very large density. These aspects together with the fact that write energy in the device is low (<1fJ), point to the potential of a very high bandwidth, low power, embedded memory that could be highly beneficial to AI applications.
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页数:4
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