Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects

被引：25

作者：

De Monlevade, Eduardo Franco ^{[1
]}

Peng, Weiqun

机构：

[1] Inst Nokia Tecnol, BR-69093415 Taruma, AM, Brazil

[2] Nokia Res Ctr, Irving, TX 75039 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2007年 / 36卷 / 07期

关键词：

lead-free soldering; intermetallic compounds; fracture; crack propagation;

D O I：

10.1007/s11664-006-0062-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Studies were conducted on Pb-free solder interconnects after aging for up to 1,000 h at temperatures of up to 150 degrees C and submitting to drop testing. Cracks were shown to propagate along interphase boundaries (bulk solder/Cu6Sn5, Cu6Sn5/Cu3Sn, Cu3Sn/Cu, and bulk solder/Ag3Sn) and along the bulk solder. Intergranular propagation in the solder was rarely observed, although cross sectioning showed evidence of that particular path. There is a transition in preferred crack propagation with aging time and temperature, from the intermetallic layer to the bulk solder. Sulfur was found in the fracture surfaces and may be a weakening agent in these solders.

引用

页码：783 / 797

页数：15

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