MEMS-based thermoelectric infrared sensors: A review

被引：96

作者：

Xu, Dehui ^{[1
]}

Wang, Yuelin ^{[1
]}

Xiong, Bin ^{[1
]}

Li, Tie ^{[1
]}

机构：

[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Sci & Technol Microsyst Lab, Shanghai 200050, Peoples R China

来源：

FRONTIERS OF MECHANICAL ENGINEERING | 2017年 / 12卷 / 04期

基金：

中国国家自然科学基金;

关键词：

thermoelectric infrared sensor; CMOS-MEMS; thermopile; micromachining; wafer-level package; STATE TEMPERATURE DISTRIBUTION; THERMOPILE IR DETECTOR; RADIATION SENSOR; CMOS TECHNOLOGY; MICROSENSORS; PERFORMANCE; ARRAY; DESIGN; LAYER; OPTIMIZATION;

D O I：

10.1007/s11465-017-0441-2

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

引用

页码：557 / 566

页数：10

共 43 条

[1] Micromachined thermally based CMOS microsensors [J].

Baltes, H ;

Paul, O ;

Brand, O .

PROCEEDINGS OF THE IEEE, 1998, 86 (08) :1660-1678

[2] Development of seed layer deposition and fast copper electroplating into deep microvias for three-dimensional integration [J].

Chen, Xiao ;

Xu, Gaowei ;

Luo, Le .

MICRO & NANO LETTERS, 2013, 8 (04) :191-192

[3] Process development of a novel wafer level packaging with TSV applied in high-frequency range transmission [J].

Chen, Xiao ;

Tang, Jiajie ;

Xu, Gaowei ;

Luo, Le .

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (04) :483-491

[4] Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing [J].

Chen, Xiao ;

Yan, Peili ;

Tang, Jiajie ;

Xu, Gaowei ;

Luo, Le .

MICROELECTRONIC ENGINEERING, 2012, 100 :6-11

[5] Characterization of thermopile based on complementary metal-oxide-semiconductor (CMOS) materials and post CMOS micromachining [J].

Du, CH ;

Lee, C .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2002, 41 (6B) :4340-4345

[6] MODEL OF THERMOELECTRIC RADIATION SENSORS MADE BY CMOS AND MICROMACHINING [J].

ELBEL, T ;

LENGGENHAGER, R ;

BALTES, H .

SENSORS AND ACTUATORS A-PHYSICAL, 1992, 35 (02) :101-106

[7] Quantitative and comparative characterizations of plasma process-induced damage in advanced metal-oxide-semiconductor devices [J].

Eriguchi, Koji ;

Ono, Kouichi .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2008, 41 (02)

[8] Complete analytical modeling and analysis of micromachined thermoelectric uncooled IR sensors [J].

Escriba, C ;

Campo, E ;

Estève, D ;

Fourniols, JY .

SENSORS AND ACTUATORS A-PHYSICAL, 2005, 120 (01) :267-276

[9] Design and fabrication of silicon-based mid infrared multi-lenses for gas sensing applications [J].

Fonollosa, J. ;

Rubio, R. ;

Hartwig, S. ;

Marco, S. ;

Santander, J. ;

Fonseca, L. ;

Woellenstein, J. ;

Moreno, M. .

SENSORS AND ACTUATORS B-CHEMICAL, 2008, 132 (02) :498-507

[10] Ethylene optical spectrometer for apple ripening monitoring in controlled atmosphere store-houses [J].

Fonollosa, J. ;

Halford, B. ;

Fonseca, L. ;

Santander, J. ;

Udina, S. ;

Moreno, M. ;

Hildenbrand, J. ;

Woellenstein, J. ;

Marco, S. .

SENSORS AND ACTUATORS B-CHEMICAL, 2009, 136 (02) :546-554

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