Folded silicon resonant accelerometer with temperature compensation

被引：11

作者：

He, L ^{[1
]}

Xu, YP ^{[1
]}

Qiu, AP ^{[1
]}

机构：

[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore

来源：

PROCEEDINGS OF THE IEEE SENSORS 2004, VOLS 1-3 | 2004年

关键词：

silicon accelerometer; resonant accelerometer; temperature compensation; MEMS; resonator;

D O I：

10.1109/ICSENS.2004.1426213

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, a novel folded silicon resonant accelerometer is proposed. The proposed structure is able to release the stress arising from the mismatch of thermal expansion between silicon structure and glass substrate and to compensate the variation of the natural frequency with temperature. The analysis has shown that both bias and scale factor stability can be improved with the proposed structure. The concept is verified by the simulation and the results show that the temperature dependence of common-mode output frequency can be greatly reduced.

引用

页码：512 / 515

页数：4