The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders

被引：7
作者：
Wang, X. [1 ]
Xiu, Y. [2 ]
Dong, M. J. [1 ]
Liu, Y. C. [1 ]
机构：
[1] Tianjin Univ, Sch Mat Sci & Engn, Tianjin Key Lab Adv Jointing Technol, Tianjin 300072, Peoples R China
[2] Tianjin Inst Urban Construct, Dept Engn Management, Tianjin 300384, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2011年 / 22卷 / 06期
关键词：
MECHANICAL-PROPERTIES; PHASE-EQUILIBRIA; ZN SYSTEM;
D O I：
10.1007/s10854-010-0182-z
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Low Ag content, Sn-Bi-Zn-Ag lead-free solders, have been studied. The microstructures of the Sn-xBi-0.9Zn-0.3Ag (x = 0, 1 and 3, in weight percent, hereafter) specimens are composed of beta-Sn phase, AgZn(3) intermetallic compounds (IMCs) and Zn-rich phase. Bi precipitates appear when the Bi content amounts to 3 wt%. The Sn-Bi-Zn-Ag alloys exhibit high performance on tensile properties, microhardness and melting temperature, owing to the existence of Bi precipitates. Moreover, the reactions upon heating and cooling of the investigated Sn-Bi-Zn-Ag lead-free solders are also systematically studied.
引用
收藏
页码：592 / 595
页数：4
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