The effect of intense plasma pulse pre-treatment on wettability in ceramic-copper system

被引：18

作者：

Barlak, M. ^{[1
]}

Piekoszewski, J.

Stanislawski, J.

Werner, Z.

Borkowska, K.

Chmielewski, M.

Sartowska, B.

Miskiewicz, M.

Starosta, W.

Walis, L.

Jagielski, J.

机构：

[1] Andrzej Soltan Inst Nucl Studies, PL-05400 Otwock, Poland

[2] Inst Nucl Chem & Technol, PL-03145 Warsaw, Poland

[3] Polish Acad Sci, Inst Phys Chem, PL-01224 Warsaw, Poland

[4] Inst Elect Mat Technol, PL-01919 Warsaw, Poland

[5] Warsaw Univ Technol, Fac Engn & Mat Sci, Mat Design Div, PL-02507 Warsaw, Poland

来源：

FUSION ENGINEERING AND DESIGN | 2007年 / 82卷 / 15-24期

关键词：

carbon ceramics copper wetting; plasma pulses; PVD coatings;

D O I：

10.1016/j.fusengdes.2007.08.010

中图分类号：

TL [原子能技术]; O571 [原子核物理学];

学科分类号：

0827 ; 082701 ;

摘要：

The aim of the present work was to improve the wettability of ceramics such as pyrolytic graphite, glassy carbon, carbon-carbon composite and silicon carbide with liquid copper using three different processes. The first process consists in applying a high intensity plasma pulse (HIPP) in deposition by pulse erosion (DPE) mode to alloy a thin (nm scale) layer of Ti into the substrate. In the second process a thicker (mu m scale) layer of Ti is deposited by ArcPVD method. The third process is a sequential combination of the above processes. Samples were characterized by electron microscopy, X-ray fluorescence, X-ray diffraction, macroscopic photography and sessile drop tests. The best results were achieved for the third process. For 70% of the tests the contact angle between Ti layer and Cu droplets was in the range 20-70 degrees. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：2524 / 2530

页数：7

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