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- [1] Thermal Modeling of Fan-Cooled Plate-Fin Heatsink Considering Air Temperature Rise for Virtual Prototyping of Power Electronics IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (11): : 1829 - 1839
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- [5] Mesh-based Lumped Parameter Model with MOR for Thermal Analysis of Virtual Prototyping for Power Electronics Systems with Comparison to FDM 2017 IEEE 3RD INTERNATIONAL FUTURE ENERGY ELECTRONICS CONFERENCE AND ECCE ASIA (IFEEC 2017-ECCE ASIA), 2017, : 1037 - 1042
- [6] Thermal and Thermomechanical Modeling to Design a Gallium Oxide Power Electronics Package 2018 IEEE 6TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2018, : 287 - 294
- [7] Rapid Modeling of Power Electronics Thermal Management Technologies 2009 IEEE VEHICLE POWER AND PROPULSION CONFERENCE, VOLS 1-3, 2009, : 562 - 569
- [8] Thermal Influence Coefficients-Based Electrothermal Modeling Approach for Power Electronics IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (08): : 1187 - 1196