Computer design strategy for MCM-D/flip-chip technology

被引:3
作者
Franzon, PD
Conte, T
Banerjia, S
Glaser, A
Lipa, S
Schaffer, T
Stanaski, A
Tekmen, Y
机构
来源
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING - IEEE 5TH TOPICAL MEETING | 1996年
关键词
D O I
10.1109/EPEP.1996.564758
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A compelling case is made for using MDM-D (thin film MultiChip Module) flip-chip technology to build a 'MegaChip' CPU consisting of an Instruction Fetch Unit and Execution Unit. By building part of the Instruction Fetch Unit in an optimized SRAM process, significant performance/cost gains are made. We also address the following important 'implementation' (1) partitioning high speed paths across the chip boundary within timing specs; (2) Ability to use off-the-shelf memories; (3) Using the MCM for power, ground, and clock distribution; (4) Managing test costs; and (5) implementing a debug strategy. This paradigm is also potentially useful for other memory intensive applications, including ATM, etc.
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页码:6 / 8
页数:3
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