Structural DNA nanotechnology is a rapidly emerging field that has demonstrated great potential for applications such as single molecule sensing, drug delivery, and templating molecular components. As the applications of DNA nanotechnology expand, a consideration of their mechanical behavior is becoming essential to understand how these structures will respond to physical interactions. This review considers three major avenues of recent progress in this area: (1) measuring and designing mechanical properties of DNA nanostructures, (2) designing complex nanostructures based on imposed mechanical stresses, and (3) designing and controlling structurally dynamic nanostructures. This work has laid the foundation for mechanically active nanomachines that can generate, transmit, and respond to physical cues in molecular systems.
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Univ Tokyo, Sch Engn, Dept Chem & Biotechnol, Bunkyo Ku, Tokyo 1138656, Japan
RIKEN Adv Sci Inst, Wako, Saitama 3510198, JapanNorthwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
Aida, T.
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Meijer, E. W.
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Eindhoven Univ Technol, Inst Complex Mol Syst, NL-5600 MB Eindhoven, NetherlandsNorthwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
Meijer, E. W.
;
Stupp, S. I.
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Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
Northwestern Univ, Dept Med, Chicago, IL 60611 USA
Northwestern Univ, Inst BioNanotechnol Med, Chicago, IL 60611 USANorthwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
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Boise State Univ, Dept Elect & Comp Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Bui, Hieu
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Onodera, Craig
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Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Onodera, Craig
;
Kidwell, Carson
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Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Kidwell, Carson
;
Tan, YerPeng
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Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Tan, YerPeng
;
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Graugnard, Elton
;
Kuang, Wan
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Boise State Univ, Dept Elect & Comp Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Kuang, Wan
;
Lee, Jeunghoon
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Boise State Univ, Dept Chem & Biochem, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Lee, Jeunghoon
;
Knowlton, William B.
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机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Boise State Univ, Dept Elect & Comp Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Knowlton, William B.
;
Yurke, Bernard
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机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Boise State Univ, Dept Elect & Comp Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Yurke, Bernard
;
Hughes, William L.
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h-index: 0
机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
机构:
Univ Tokyo, Sch Engn, Dept Chem & Biotechnol, Bunkyo Ku, Tokyo 1138656, Japan
RIKEN Adv Sci Inst, Wako, Saitama 3510198, JapanNorthwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
Aida, T.
;
Meijer, E. W.
论文数: 0引用数: 0
h-index: 0
机构:
Eindhoven Univ Technol, Inst Complex Mol Syst, NL-5600 MB Eindhoven, NetherlandsNorthwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
Meijer, E. W.
;
Stupp, S. I.
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
Northwestern Univ, Dept Med, Chicago, IL 60611 USA
Northwestern Univ, Inst BioNanotechnol Med, Chicago, IL 60611 USANorthwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
机构:
Boise State Univ, Dept Elect & Comp Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Bui, Hieu
;
Onodera, Craig
论文数: 0引用数: 0
h-index: 0
机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Onodera, Craig
;
Kidwell, Carson
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h-index: 0
机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Kidwell, Carson
;
Tan, YerPeng
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h-index: 0
机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Tan, YerPeng
;
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Graugnard, Elton
;
Kuang, Wan
论文数: 0引用数: 0
h-index: 0
机构:
Boise State Univ, Dept Elect & Comp Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Kuang, Wan
;
Lee, Jeunghoon
论文数: 0引用数: 0
h-index: 0
机构:
Boise State Univ, Dept Chem & Biochem, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Lee, Jeunghoon
;
Knowlton, William B.
论文数: 0引用数: 0
h-index: 0
机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Boise State Univ, Dept Elect & Comp Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Knowlton, William B.
;
Yurke, Bernard
论文数: 0引用数: 0
h-index: 0
机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Boise State Univ, Dept Elect & Comp Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA
Yurke, Bernard
;
Hughes, William L.
论文数: 0引用数: 0
h-index: 0
机构:
Boise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USABoise State Univ, Dept Mat Sci & Engn, Boise, ID 83725 USA