Lithographic tradeoffs between different assist feature OPC design strategies

被引:3
|
作者
Word, J [1 ]
Zhu, SH [1 ]
机构
[1] Integrated Device Technol, Hillsboro, OR 97124 USA
来源
DESIGN AND PROCESS INTEGRATION FOR MICROELECTRONIC MANUFACTURING | 2003年
关键词
scatter bar; assist feature; SRAF; OPC; RET; DRC;
D O I
10.1117/12.485326
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In recent years many of the problems associated with the use of assist features have been partially or completely resolved. Such issues include mask manufacturing and inspection, software maturity, and the so-called forbidden pitch problem. Still, the lithographer is faced with numerous choices in developing production worthy assist feature designs. This paper will examine some of the choices, and the tradeoffs associated with each. In particular the choice between simple one-dimensional scatter bar designs and various two-dimensional designs will be explored to determine the tradeoffs. with lithographic performance. A DRC (Design Rule Check) -driven technique has been developed to highlight potential shortcomings of each individual design strategy. The lithographic impact of these shortcomings has been confirmed with on-Silicon process data.
引用
收藏
页码:293 / 304
页数:12
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