Hybrid integrated optical subassembly module using a polymeric wavelength division multiplexing filter based on multimode interference for 1.31-and 1.55-μm bidirectional operation

被引：0

作者：

Lim, Jung Woon ^{[1
]}

Hwang, Sung Hwan ^{[1
]}

Lee, Woo-Jin ^{[1
]}

Lee, Tae Ho ^{[2
]}

Jeong, Myung Yong ^{[2
]}

Kim, Boo-Gyoun ^{[3
]}

Rho, Byung Sup ^{[1
]}

机构：

[1] Korea Photon Technol Inst, Integrated Opt Module Lab, Kwangju 500460, South Korea

[2] Pusan Natl Univ, Dept Nanosyst & Nanoproc Engn, Pusan 609735, South Korea

[3] Soongsil Univ, Sch Elect Engn, Seoul 156743, South Korea

来源：

OPTICAL ENGINEERING | 2010年 / 49卷 / 06期

关键词：

wavelength division multiplexing; multimode interference; hybrid integrated subassembly module; hot embossing technique; flip-chip bonding technique; PLANAR LIGHTWAVE CIRCUIT; FABRICATION;

D O I：

10.1117/1.3454385

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

We present a new configuration for a polymer wavelength division multiplexing (WDM) filter based on multimode interference. We developed a hybrid integrated subassembly module for 1.31- and 1.55-mu m bidirectional operation. Active devices including a laser diode with a monitoring photodiode and a receiving photodiode were integrated on a silicon optical bench (SiOB) platform using a flip-chip bonding technique. A polymer WDM filter chip made of polymethylmethacrylate was fabricated using a hot embossing technique. We then investigated the optical performance of the transmitter and receiver subassembly module using a SiOB platform. This hybrid integrated subassembly module exhibited bidirectional 2.5-Gbit/s signal modulation with a minimum sensitivity of -20.5 dBm at a bit error rate of 10(-10) and an optical crosstalk of -35 dB. (C) 2010 Society of Photo-Optical Instrumentation Engineers. [DOI: 10.1117/1.3454385]

引用

页数：7