Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures

被引：5
作者：
Fayad, WR [1 ]
Andleigh, VK [1 ]
Thompson, CV [1 ]
机构：
[1] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA
来源：
JOURNAL OF MATERIALS RESEARCH | 2001年 / 16卷 / 02期
关键词：
D O I：
10.1557/JMR.2001.0062
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
We presented a model for the line-width-dependent grain structure statistics in bamboo interconnects, We then showed, using an electromigration simulation, that grain orientation-dependent interface diffusivities constitute a likely mechanism contributing to the variabilities in lifetimes observed in experiments.
引用
收藏
页码：413 / 416
页数：4
相关论文
共 26 条
  • [1] The microstructure and electromigration performance of Damascene-fabricated aluminum interconnects
    Besser, PR
    Sanchez, JE
    Field, DP
    Pramanick, S
    Sahota, K
    [J]. MATERIALS RELIABILITY IN MICROELECTRONICS VII, 1997, 473 : 217 - 222
  • [2] Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin films
    Carel, R
    Thompson, CV
    Frost, HJ
    [J]. ACTA MATERIALIA, 1996, 44 (06) : 2479 - 2494
  • [3] GRAIN-SIZE DEPENDENCE OF ELECTROMIGRATION-INDUCED FAILURES IN NARROW INTERCONNECTS
    CHO, J
    THOMPSON, CV
    [J]. APPLIED PHYSICS LETTERS, 1989, 54 (25) : 2577 - 2579
  • [4] CHOI JY, 1962, T METALL SOC AIME, V224, P589
  • [5] Crystallographic study of electromigration failure sites in submicron Al(Cu) interconnects
    Chu, X
    Prybyla, JA
    Theiss, SK
    Marcus, MA
    [J]. APPLIED PHYSICS LETTERS, 1999, 75 (24) : 3790 - 3792
  • [6] Steady-state grain-size distributions resulting from grain growth in two dimensions
    Fayad, W
    Thompson, CV
    Frost, HJ
    [J]. SCRIPTA MATERIALIA, 1999, 40 (10) : 1199 - 1204
  • [7] Analytic model for the development of bamboo microstructures in thin film strips undergoing normal grain growth
    Fayad, WR
    Kobrinsky, MJ
    Thompson, CV
    [J]. PHYSICAL REVIEW B, 2000, 62 (08): : 5221 - 5227
  • [8] A 2-DIMENSIONAL COMPUTER-SIMULATION OF CAPILLARITY-DRIVEN GRAIN-GROWTH - PRELIMINARY-RESULTS
    FROST, HJ
    THOMPSON, CV
    HOWE, CL
    WHANG, JH
    [J]. SCRIPTA METALLURGICA, 1988, 22 (01): : 65 - 70
  • [9] SIMULATION OF THIN-FILM GRAIN STRUCTURES .1. GRAIN-GROWTH STAGNATION
    FROST, HJ
    THOMPSON, CV
    WALTON, DT
    [J]. ACTA METALLURGICA ET MATERIALIA, 1990, 38 (08): : 1455 - 1462
  • [10] Microstructure control in semiconductor metallization
    Harper, JME
    Rodbell, KP
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1997, 15 (04): : 763 - 779
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