Extreme anisotropy of electromigration: Nickel in single-crystal tin

被引：14

作者：

Wei, S. ^{[1
]}

Ma, H. C. ^{[1
]}

Chen, J. Q. ^{[1
]}

Guo, J. D. ^{[1
]}

机构：

[1] Univ Sci & Technol China, Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res,Sch Mat Sci & Engn, Shenyang 110016, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2016年 / 687卷

关键词：

Electromigration; Single crystal; Solder; Intermetallics; Anisotropy; SOLDER JOINTS; SN GRAIN; BETA-SN; DIFFUSION; ORIENTATION; INTERCONNECT; DISSOLUTION; FAILURE;

D O I：

10.1016/j.jallcom.2016.06.253

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A new approach is developed to fabricate single-crystal Sn solder joints with a line-type structure. The primary purpose is to investigate the diffusion characteristics of Ni in single-crystal Sn with four different grain orientations during electromigration. An interesting new experimental phenomenon that Ni3Sn4 forms on the surfaces of single-crystal Sn with regularity occurs which should be attributed to the extremely anisotropic diffusion property of Ni in single-crystal Sn. Besides, the diffusion velocity of Ni in single-crystal Sn during electromigration is ranked as followed: (001)> (101)> (301)> (100). Experimental observations are in good agreement with kinetic analysis. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：999 / 1003

页数：5

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