Extreme anisotropy of electromigration: Nickel in single-crystal tin

被引：14
作者：
Wei, S. [1 ]
Ma, H. C. [1 ]
Chen, J. Q. [1 ]
Guo, J. D. [1 ]
机构：
[1] Univ Sci & Technol China, Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res,Sch Mat Sci & Engn, Shenyang 110016, Peoples R China
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2016年 / 687卷
关键词：
Electromigration; Single crystal; Solder; Intermetallics; Anisotropy; SOLDER JOINTS; SN GRAIN; BETA-SN; DIFFUSION; ORIENTATION; INTERCONNECT; DISSOLUTION; FAILURE;
D O I：
10.1016/j.jallcom.2016.06.253
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
A new approach is developed to fabricate single-crystal Sn solder joints with a line-type structure. The primary purpose is to investigate the diffusion characteristics of Ni in single-crystal Sn with four different grain orientations during electromigration. An interesting new experimental phenomenon that Ni3Sn4 forms on the surfaces of single-crystal Sn with regularity occurs which should be attributed to the extremely anisotropic diffusion property of Ni in single-crystal Sn. Besides, the diffusion velocity of Ni in single-crystal Sn during electromigration is ranked as followed: (001)> (101)> (301)> (100). Experimental observations are in good agreement with kinetic analysis. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码：999 / 1003
页数：5
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