Fabrication of Terahertz Components using 3D Printed Templates

被引：8

作者：

Byford, Jennifer A. ^{[1
]}

Purtill, Zachary ^{[1
]}

Chahal, Premjeet ^{[1
]}

机构：

[1] Michigan State Univ, Dept Elect Engn, E Lansing, MI 48824 USA

来源：

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2016年

关键词：

terahertz; fabrication; 3D printing; WAVE-GUIDE; MILLIMETER-WAVE;

D O I：

10.1109/ECTC.2016.193

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new fabrication process for passive terahertz components is introduced. Molds are 3D printed on a commercially available 3D printer using rigid opaque material Vero White. An injection molding machine is used to melt low density polyethylene (LDPE) and high density polyethelene (HDPE) pellets to fill the molds. Sample components are designed in ANSYS HFSS (R) and fabricated using the new process including a set of lenses, various dielectric ridge waveguides, a photonic crystal filter, and probes. Samples are then measured using a frequency domain terahertz system and compared to their expected performance from simulation.

引用

页码：817 / 822

页数：6

共 17 条

[1]

[Anonymous], 1993, GUIDED WAVE LETT

[2] Performance of silicon micromachined waveguide at W-band [J].

Becker, JP ;

East, JR ;

Katehi, LPB .

ELECTRONICS LETTERS, 2002, 38 (13) :638-639

[3]

Biber S, 2004, MSMW'04: FIFTH INTERNATIONAL KHARKOV SYMPOSIUM ON PHYSICS AND ENGINEERING OF MICROWAVES, MILLIMETER, AND SUBMILLIMETER WAVES, SYMPOSIUM PROCEEDINGS, VOLS 1 AND 2, P26

[4]

Boorse C., 2011, IRMMW THZ 2011, P11

[5]

Cai Y., 2005, P SOC PHOTO-OPT INS

[6] A new micro-machined millimeter-wave and terahertz snap-together rectangular waveguide technology [J].

Collins, CE ;

Miles, RE ;

Digby, JW ;

Parkhurst, GM ;

Pollard, RD ;

Chamberlain, JM ;

Steenson, DP ;

Cronin, NJ ;

Davies, SR ;

Bowen, JW .

IEEE MICROWAVE AND GUIDED WAVE LETTERS, 1999, 9 (02) :63-65

[7] Fabrication and characterization of micromachined rectangular waveguide components for use at millimeter-wave and terahertz frequencies [J].

Digby, JW ;

McIntosh, CE ;

Parkhurst, GM ;

Towlson, BM ;

Hadjiloucas, S ;

Bowen, JW ;

Chamberlain, JM ;

Pollard, RD ;

Miles, RE ;

Steenson, DP ;

Karatzas, LS ;

Cronin, NJ ;

Davies, SR .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2000, 48 (08) :1293-1302

[8]

Ghazali MIM, 2015, ELEC COMP C, P240, DOI 10.1109/ECTC.2015.7159599

[9] Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages [J].

Hejase, Jose A. ;

Paladhi, Pavel R. ;

Chahal, Premjeet 'Prem' .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (11) :1685-1694

[10]

Hejase JA, 2011, ELEC COMP C, P1035, DOI 10.1109/ECTC.2011.5898637

← 1 2 →