Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

被引：24
|
作者：
Zhang, Hanzhuo [1 ]
Jiang, Zhonghao [1 ]
Lian, Hanshe [1 ]
Jiang, Qing [1 ]
机构：
[1] Jilin Univ, Key Lab Automobile Mat, Dept Mat Sci & Engn, Changchun 130025, Peoples R China
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2008年 / 479卷 / 1-2期
关键词：
ultrafine-grained; strain rate; ductility; work hardening; shear localization;
D O I：
10.1016/j.msea.2007.06.027
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Tensile behavior of an electrodeposited Cu with ultrafine grain size of similar to 200nm was studied at different strain rates and room temperature. By increasing the strain rate the elongation to fracture increased noticeably. Analysis on the deformed and fracture surfaces suggested a shear localization process in the necking stage, which led to a different tendency of cracking. Strong strain rate dependences of work hardening and shear localization might be responsible for variation of the tensile ductility. (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码：136 / 141
页数：6
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