Development of joining technology for Be/Cu-alloy and Be/SS by HIP

被引：12

作者：

Kuroda, T ^{[1
]}

Hatano, T

Enoeda, M

Sato, S

Furuya, K

Takatsu, H

Iwadachi, T

Nishida, K

机构：

[1] Japan Atom Energy Res Inst, Naka Fus Res Estab, Naka, Ibaraki 3110193, Japan

[2] NGK Insulators Ltd, New Met Div, Handa, Aichi 4750825, Japan

来源：

JOURNAL OF NUCLEAR MATERIALS | 1998年 / 258卷

关键词：

D O I：

10.1016/S0022-3115(98)00082-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Joining of Be/DSCu and Be/SS by using HIP technique with and without various interlayers were investigated, as a screening test for selecting optimum joining method and conditions. Metallurgical observation and shearing tests were performed for basic characterization of the bonded joints. For Be/DSC, the use of Ag interlayer with 700 degrees C HIP. temperature would be a prime candidate if Cd formation under neutron irradiation would not seriously affect plasma operation and joint performance. Other than the Ag interlayer, a Cr/Cu interlayer gave relatively high joint strength in the present screening test. The lower HIP temperature, 550 degrees C, for this joint contributes to prevent sensitization of stainless steel (SS) structural material. As for Be/SS, the highest joint strength was obtained with a Ti interlayer. The HIP temperature of 800 degrees C or a little higher would be applied for this joint to avoid SS sensitization. (C) 1998 Elsevier Science B.V. All rights reserved.

引用

页码：258 / 264

页数：7