In-situ TEM observation of shear induced microstructure evolution in Cu-Nb alloy

被引:11
作者
Li, Shuang [1 ]
Olszta, Matthew [2 ]
Li, Lei [3 ]
Gwalani, Bharat [3 ]
Soulami, Ayoub [3 ]
Powell, Cynthia A. [2 ]
Mathaudhu, Suveen [2 ,4 ,5 ]
Devaraj, Arun [3 ]
Wang, Chongmin [1 ]
机构
[1] Pacific Northwest Natl Lab, Environm Mol Sci Lab EMSL, Richland, WA 99352 USA
[2] Pacific Northwest Natl Lab, Energy & Environm Directorate, Richland, WA 99352 USA
[3] Pacific Northwest Natl Lab, Phys & Computat Sci Directorate, Richland, WA 99352 USA
[4] Univ Calif Riverside, Mech Engn & Mat Sci & Engn, Riverside, CA 92521 USA
[5] Univ Calif Riverside, Mat Sci & Engn Program, Riverside, CA 92521 USA
基金
美国国家科学基金会;
关键词
In-situ TEM; Shear deformation; Crystal defects; Dual phases; LOMER-COTTRELL LOCKS; GRAIN-SIZE CHANGES; DEFORMATION; DRIVEN; AMORPHIZATION; INTERFACES; DIFFUSION; STRENGTH; FRACTURE; COPPER;
D O I
10.1016/j.scriptamat.2021.114214
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Phase boundaries in multiphase alloys govern defect interaction and chemical intermixing across different phases during plastic deformation. Dynamic interaction of defects with phase boundaries in multiphase alloys, especially for immiscible alloys, has generated more research interest in recent years. Here, we describe a novel approach for carrying out in-situ TEM shear deformation to directly observe interfacial microstructural evolution of a Cu-Nb alloy. A unique double shear specimen geometry is microfabricated by a focused ion beam technique to apply shear deformation upon push loading inside the TEM. From the real-time observation, we discover that the phase boundary with a zigzag morphology effectively blocks stacking faults nucleated in a Cu grain from slipping into a Nb grain. Meanwhile, the Cu phase bears the most plastic deformation through slip or twinning mechanisms. This work sheds light on understanding the shear deformation and the behavior of phase boundaries in multiphase alloys during shear deformation. (c) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
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页数:5
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