Reliability Study of a MEMS Array Under Varying Temperature and Humidity

被引:0
|
作者
Sivakumar, Ganapathy [1 ]
Ranganathan, Ranjith [1 ]
Gale, Richard [1 ]
Dallas, Tim [1 ]
机构
[1] Texas Tech Univ, Dept Elect Eng, Lubbock, TX 79409 USA
来源
RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES IX | 2010年 / 7592卷
关键词
stiction; reliability; Weibull; humidity; self-assembled monolayer; MONOLAYER FILMS; STICTION; ADHESION;
D O I
10.1117/12.842384
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this work, we quantify and analyze the rate of accrual of stiction and mechanical fatigue in a MEMS micro-mirror device to understand its reliability under a set of controlled temperature and humidity splits. An accelerated aging system was employed by using a non-standard actuation procedure to more rapidly induce failure of the micro-mirrors. The array is hermetically packaged with a low surface energy self-assembled-monolayer (SAM) based anti-stiction coating, along with an encapsulated source of this anti-stiction coating that serves as a reservoir. Exposure of the micro-mirror array to the environmental conditions was made possible by drilling two 1 mm holes in the hermetic package. This enabled the retention of the encapsulated SAM source in the package which was vital to understanding the effects of SAM re-deposition on the surface in the operating environment. The fastest accrual of stiction was seen in the 90 degrees C, 80% RH split with approximately 80% of the micro-mirrors failing within 4.4 x 10(9) cycles (10 hours) with 2.7x10(-14) Joules of Stiction Equivalent Energy while the 60 degrees C, 20% RH showed the least stiction accrual rate with less than 2% failure for 2.26x10(12) cycles (1500 hours). The failure data obtained from the experiments were used to do a reliability analysis by utilizing the Weibull distribution.
引用
收藏
页数:9
相关论文
共 50 条
  • [41] Assessment of LoRaWAN Transmission Systems Under Temperature and Humidity, Gas, and Vibration Aging Effects Within IIoT Contexts
    Di Renzone, Gabriele
    Landi, Elia
    Mugnaini, Marco
    Parri, Lorenzo
    Peruzzi, Giacomo
    Pozzebon, Alessandro
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2022, 71
  • [42] INFLUENCE OF VARYING SOIL PROPERTIES ON EVALUATION OF PILE RELIABILITY UNDER LATERAL LOADS
    Kozubal, Janusz
    Pula, Wojciech
    Wyjadlowski, Marek
    Bauer, Jerzy
    JOURNAL OF CIVIL ENGINEERING AND MANAGEMENT, 2013, 19 (02) : 272 - 284
  • [43] No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics
    Piotrowska, Kamila
    Grzelak, Magdalena
    Ambat, Rajan
    JOURNAL OF ELECTRONIC MATERIALS, 2019, 48 (02) : 1207 - 1222
  • [44] No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics
    Kamila Piotrowska
    Magdalena Grzelak
    Rajan Ambat
    Journal of Electronic Materials, 2019, 48 : 1207 - 1222
  • [45] Temperature-humidity-bias reliability using Mahalanobis distance analysis Prognostics of ceramic capacitor
    Nie, Lei
    Azarian, Michael H.
    Keimasi, Mohammadreza
    Pecht, Michael
    CIRCUIT WORLD, 2007, 33 (03) : 21 - 28
  • [46] Prediction of the electrochemical migration induced failure on power PCBs under humidity condition - A case study
    Xue, Peng
    Bahman, Amir Sajjad
    Iannuzzo, Francesco
    Gudla, Helene Conseil
    Lakkaraju, Anish Rao
    Ambat, Rajan
    MICROELECTRONICS RELIABILITY, 2022, 139
  • [47] Variation characteristics of temperature and humidity in North Grottoes under different opening regulation
    Zhang B.
    Cui H.
    Pei Q.
    Guo Q.
    Wang Y.
    Yang S.
    Yanshilixue Yu Gongcheng Xuebao/Chinese Journal of Rock Mechanics and Engineering, 2021, 40 : 2834 - 2840
  • [48] P-wave propagation in dry rocks under controlled temperature and humidity
    Nakao, Akimasa
    Nara, Yoshitaka
    Kubo, Taiki
    INTERNATIONAL JOURNAL OF ROCK MECHANICS AND MINING SCIENCES, 2016, 86 : 157 - 165
  • [49] Fabrication and reliability study of a double spiral platinum-based MEMS hotplate
    Prasad, Mahanth
    Arya, Dhairya
    Khanna, Vinod
    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2015, 14 (02):
  • [50] An Analytical Model of Transient Response of MEMS under High-G shock for Reliability Assessment
    Peng, Tianfang
    You, Zheng
    2022 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2022,