Thermal management technology of high-power light-emitting diodes for automotive headlights

被引：2

作者：

Qu, Hui-Ming ^{[1
]}

Yang, Xiao-Hui ^{[2
]}

Zheng, Qi ^{[1
]}

Wang, Xin-Tao ^{[1
]}

Chen, Qian ^{[1
]}

机构：

[1] Nanjing Univ Sci & Technol, Sch Elect Engn & Optoelect Technol, Nanjing 210094, Jiangsu, Peoples R China

[2] Nanjing Elect Devices Inst, Nanjing 210016, Jiangsu, Peoples R China

来源：

IEICE ELECTRONICS EXPRESS | 2014年 / 11卷 / 23期

基金：

中国国家自然科学基金;

关键词：

LED automotive headlight; thermal management; cooling structure; thermal simulation; temperature feedback; COOLING SYSTEM; TEMPERATURE ESTIMATION; JUNCTION TEMPERATURE; HEADLAMP; LEDS; PERFORMANCE; PACKAGE; DESIGN; CHIP;

D O I：

10.1587/elex.11.20140965

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The heat dissipation problem of high-power LEDs (Light-Emitting Diodes) limits their applications in automobile headlights. The heat demand for cooling LED headlights is analyzed based on heat transfer theory. This study proposes an initiative heat dissipation technology of temperature feedback control combined heat pipe and heat sink. The corresponding hardware and software control processes are designed. The temperature feedback control is realized with an MCU (Micro Control Unit) that judges and controls the synthetic jet device working process. A 3D model for the heat pipe radiator is constructed using CATIA. The model is optimized with the fluid thermodynamic simulation software FLOEFD. Finally, a sample lamp is prepared and tested with an infrared thermometer. The temperature distribution on each LED light source and radiator fin is quantitatively measured and analyzed. These results confirm that the designs of the thermal management system and the proposed technique solve the heat dissipation problem of high-power LED automotive headlights under the ambient temperature 50 degrees C indeed.

引用

页数：11

共 34 条

[1] Optimal design of miniature piezoelectric fans for cooling light emitting diodes [J].

Açikalin, T ;

Garimella, SV ;

Petroski, J ;

Raman, A .

ITHERM 2004, VOL 1, 2004, :663-671

[2] Thermal management of LEDs: Package to system [J].

Arik, M ;

Becker, C ;

Weaver, S ;

Petroski, J .

THIRD INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5187 :64-75

[3] Chip to system levels thermal needs and alternative thermal technologies for high brightness LEDS [J].

Arik, Mehmet ;

Setlur, Anant ;

Weaver, Stanton ;

Haitko, Deborah ;

Petroski, James .

JOURNAL OF ELECTRONIC PACKAGING, 2007, 129 (03) :328-338

[4] Study on the cooling enhancement of LED heat sources via an electrohydrodynamic approach [J].

Chau, S. W. ;

Lin, C. H. ;

Yeh, C. H. ;

Yang, C. .

IECON 2007: 33RD ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY, VOLS 1-3, CONFERENCE PROCEEDINGS, 2007, :2934-2937

[5] Design method of high-efficient LED headlamp lens [J].

Chen, Fei ;

Wang, Kai ;

Qin, Zong ;

Wu, Dan ;

Luo, Xiaobing ;

Liu, Sheng .

OPTICS EXPRESS, 2010, 18 (20) :20926-20938

[6] Computer modeling of a fiber-and-light-emitting-diode-based vehicle headlamp [J].

Chen, Jin-Jia ;

Huang, Kuang-Lung ;

Lin, Po-Chun .

OPTICAL ENGINEERING, 2010, 49 (07)

[7] Dynamic junction temperature measurement for high power light emitting diodes [J].

Chen, Quan ;

Luo, Xiaobing ;

Zhou, Shengjun ;

Liu, Sheng .

REVIEW OF SCIENTIFIC INSTRUMENTS, 2011, 82 (08)

[8] Thermal effects in packaging high power light emitting diode arrays [J].

Christensen, Adam ;

Graham, Samuel .

APPLIED THERMAL ENGINEERING, 2009, 29 (2-3) :364-371

[9] Etendue-preserving mixing and projection optics for high-luminance LEDs, applied to automotive headlamps [J].

Cvetkovic, Aleksandra ;

Dross, Oliver ;

Chaves, Julio ;

Benitez, Pablo ;

Minano, Juan C. ;

Mohedano, Ruben .

OPTICS EXPRESS, 2006, 14 (26) :13014-13020

[10] Development of a thermal resistance model for chip-on-board packaging of high power LED arrays [J].

Ha, Minseok ;

Graham, Samuel .

MICROELECTRONICS RELIABILITY, 2012, 52 (05) :836-844

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