CI-Block: A Blockchain System for Information Management of Collaborative Innovation

被引:0
作者
Ma, Ruhao [1 ]
Meng, Fansheng [1 ]
Du, Haiwen [2 ,3 ]
机构
[1] Harbin Engn Univ, Sch Econ & Management, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, Sch Astronaut, Harbin 150001, Peoples R China
[3] Univ Coll Dublin, Insight Ctr Data Analyt, Sch Comp Sci, Dublin, Ireland
关键词
Consensus model; blockchain; collaborative innovation; discrete manufacturing;
D O I
10.32604/iasc.2022.026748
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Blockchain technology ensures the security of cross-organizational data sharing in the process of collaborative innovation. It drives the development of collaborative innovation in discrete manufacturing to intelligent innovation. However, collaborative innovation is a multi-role, networked, and open resource-sharing process. Therefore, it is easy to form information barriers and increase the risk of cooperation between organizations. In this paper, we firstly analyze the blockchain-based information management models in the traditional discrete manufacturing collaborative innovation process. Then, we found that in the process of industry-university-research (IUR) collaborative innovation, consensus servers maintain too many connections due to the high latency between them, which leads to lower consensus performance and efficiency. To solve this problem, we proposed the dependency analysis (DA) model, which separates and assembles transactional data and non-transactional data into different blocks by analyzing read_set and write _set of transactions. Besides, we propose the out-of-order Lft (OORaft) model to allow non-transactional blocks to be copied in parallel, which can also prioritize transactional blocks. Finally, we implement the blockchain model in the discrete manufacturing scenario based on Hyperledger Fabric. The experimental results show that our model improves the transactions per second (TPS) performance of 1.9X-3.7X and reduces transactional data committing latency by more than 40% in the target scenario.
引用
收藏
页码:1623 / 1637
页数:15
相关论文
共 24 条
  • [1] An Intelligent Hybrid Mutual Authentication Scheme for Industrial Internet of Thing Networks
    Adil, Muhammad
    Ali, Jehad
    Khan, Muhammad Sajjad
    Kim, Junsu
    Alturki, Ryan
    Zakarya, Mohammad
    Khan, Mukhtaj
    Khan, Rahim
    Kim, Su Min
    [J]. CMC-COMPUTERS MATERIALS & CONTINUA, 2021, 68 (01): : 447 - 470
  • [2] Blockchain Consistency Check Protocol for Improved Reliability
    Alwabel, Mohammed
    Kwon, Youngmi
    [J]. COMPUTER SYSTEMS SCIENCE AND ENGINEERING, 2021, 36 (02): : 281 - 292
  • [3] Bach LM, 2018, 2018 41ST INTERNATIONAL CONVENTION ON INFORMATION AND COMMUNICATION TECHNOLOGY, ELECTRONICS AND MICROELECTRONICS (MIPRO), P1545, DOI 10.23919/MIPRO.2018.8400278
  • [4] Backman J, 2017, 2017 JOINT 13TH CTTE AND 10TH CMI CONFERENCE ON INTERNET OF THINGS - BUSINESS MODELS, USERS, AND NETWORKS
  • [5] The open innovation paradox: knowledge sharing and protection in R&D collaborations
    Bogers, Marcel
    [J]. EUROPEAN JOURNAL OF INNOVATION MANAGEMENT, 2011, 14 (01) : 93 - +
  • [6] The framework design of smart factory in discrete manufacturing industry based on cyber-physical system
    Chen, Gaige
    Wang, Pei
    Feng, Bo
    Li, Yihui
    Liu, Dekun
    [J]. INTERNATIONAL JOURNAL OF COMPUTER INTEGRATED MANUFACTURING, 2020, 33 (01) : 79 - 101
  • [7] A Full-Spectrum Blockchain-as-a-Service for Business Collaboration
    Chen, Yaoliang
    Gu, Jingxiao
    Chen, Shi
    Huang, Sheng
    Wang, X. Sean
    [J]. 2019 IEEE INTERNATIONAL CONFERENCE ON WEB SERVICES (IEEE ICWS 2019), 2019, : 219 - 223
  • [8] Energy-Aware Scheduling for Tasks with Target-Time in Blockchain based Data Centres
    Devi, I
    Karpagam, G. R.
    [J]. COMPUTER SYSTEMS SCIENCE AND ENGINEERING, 2022, 40 (02): : 405 - 419
  • [9] Du H., 2021, IEEE INTERNET THINGS, P1
  • [10] Blockchain Data Privacy Access Control Based on Searchable Attribute Encryption
    Feng, Tao
    Pei, Hongmei
    Ma, Rong
    Tian, Youliang
    Feng, Xiaoqin
    [J]. CMC-COMPUTERS MATERIALS & CONTINUA, 2021, 66 (01): : 871 - 884