An investigation of the influence of selenium on copper deposition during electrorefining using electrochemical noise analysis

被引：15

作者：

Safizadeh, Fariba ^{[1
]}

Lafront, Anne-Marie ^{[1
]}

Ghali, Edward ^{[1
]}

Houlachi, Georges ^{[2
]}

机构：

[1] Univ Laval, Dept Min Met & Mat Engn, Quebec City, PQ G1K 7P4, Canada

[2] Hydroquebec, LTE, Shawinigan, PQ G9N 7N5, Canada

来源：

HYDROMETALLURGY | 2012年 / 111卷

基金：

加拿大自然科学与工程研究理事会;

关键词：

Electrochemical noise analysis; Impurity; Copper electrodeposition; Selenium; ELECTRODEPOSITION CHEMISTRY; SYSTEM; ELECTROLYTE; GELATIN;

D O I：

10.1016/j.hydromet.2011.09.008

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The influence of selenium impurities on copper deposition at 65 degrees C in industrial sulfuric acid electrolyte (standard) was investigated using electrochemical noise analysis and cyclic voltammetry in conjunction with scanning electron microscopy and X-ray diffraction. The results were compared with those obtained with synthetic electrolyte containing thiourea and gelatin additives. The presence of selenium ions in the standard electrolyte and the electrolyte containing additives resulted in a spongy and porous copper deposit covered by a non-adherent black powder of copper-selenium compounds. The measured statistical parameters of skewness and kurtosis of the EN signals correlated well with the presence of the spongy morphology on the cathode surface. (C) 2011 Elsevier B.V. All rights reserved.

引用

页码：29 / 34

页数：6

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