Stabilization of hexagonal Cu6(Sn,Zn)5 by minor Zn doping of Sn-based solder joints

被引：59

作者：

Yu, Chi-Yang ^{[1
]}

Duh, Jenq-Gong ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan

来源：

SCRIPTA MATERIALIA | 2011年 / 65卷 / 09期

关键词：

Intermetallic compound; Solder; Thermal stability; Phase transformation; CU TERNARY-SYSTEM; PB-FREE SOLDERS; ORIENTATION RELATIONSHIPS; INTERFACIAL REACTIONS; PHASE-STABILITY; CU6SN5; NI; ALLOYS;

D O I：

10.1016/j.scriptamat.2011.07.029

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Cu6Sn5 is the dominant intermetallic compound at the Sn/Cu joint interface. The crystal structure of Cu6Sn5 varies with temperature. After reflow at 250 degrees C, interfacial Cu6Sn5 revealed a hexagonal structure (eta-Cu6Sn5). During aging at 150 degrees C, hexagonal eta-Cu6Sn5 transforms into monoclinic eta'-Cu6Sn5. X-ray diffraction and differential scanning calorimetry analyses show that doping small amounts of Zn (0.8-2.1 at.%) into Cu-6(Sn,Zn)(5) can stabilize the hexagonal structure during the thermal aging process. Thermodynamic calculation also demonstrates that Zn stabilizes the hexagonal Cu-6(Sn,Zn)(5). Crown Copyright (C) 2011 Published by Elsevier Ltd. on behalf of Acta Materialia Inc. All rights reserved.

引用

页码：783 / 786

页数：4

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