Dense graphene foam and hexagonal boron nitride filled PDMS composites with high thermal conductivity and breakdown strength

被引:115
作者
Fang, Haoming [1 ]
Zhang, Xiao [1 ,2 ]
Zhao, Yunhong [1 ]
Bai, Shu-Lin [1 ]
机构
[1] Peking Univ, Coll Engn, Minist Educ, Dept Mat Sci & Engn,HEDPS CAPT,Key Lab Polymer Ch, Beijing 100871, Peoples R China
[2] Mech Engn Coll, Shijiazhuang 050003, Hebei, Peoples R China
关键词
Compressed graphene foam; Hexagonal boron nitride; Polymer composite; Double percolated networks; Thermal and insolated properties; NANOTUBES TERNARY COMPOSITES; POLYMER COMPOSITES; ELASTOMER COMPOSITES; THERMOPLASTIC COMPOSITES; SYNERGISTIC IMPROVEMENT; SILVER NANOPARTICLES; SEGREGATED STRUCTURE; NANOSHEETS; ENHANCEMENT; EPOXY;
D O I
10.1016/j.compscitech.2017.09.032
中图分类号
TB33 [复合材料];
学科分类号
摘要
In the present study, high thermally conductive and electrically insulated polymer composites containing modified dense graphene foam (MGF) and modified hexagonal boron nitride (M-h-BN) via polydopamine (PDA) coating and 3-aminopropyltriethoxysilane (APTS) grafting were manufactured and studied. Due to the double percolated networks built by MGF and M-h-BN, the polydimethylsiloxane (PDMS) matrix composite has high thermal conductivity of 23.45Wm(-1)K(-1) and 2.11Wm(-1)K(-1) in in-plane and out-of-plane directions, respectively. In addition, an insulated layer of M-h-BN/PDMS can be introduced onto both sides of composite sample with the help of infiltration technique, which results in a high breakdown strength of 4.5 kV/mm. Owing to the excellent comprehensive properties, the M-h-BN/MGF/PDMS composite has a promising application in heat management field of the microelectronic industry. (C) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码:243 / 253
页数:11
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