Dense graphene foam and hexagonal boron nitride filled PDMS composites with high thermal conductivity and breakdown strength

被引：121
作者：
Fang, Haoming [1 ]
Zhang, Xiao [1 ,2 ]
Zhao, Yunhong [1 ]
Bai, Shu-Lin [1 ]
机构：
[1] Peking Univ, Coll Engn, Minist Educ, Dept Mat Sci & Engn,HEDPS CAPT,Key Lab Polymer Ch, Beijing 100871, Peoples R China
[2] Mech Engn Coll, Shijiazhuang 050003, Hebei, Peoples R China
来源：
COMPOSITES SCIENCE AND TECHNOLOGY | 2017年 / 152卷
关键词：
Compressed graphene foam; Hexagonal boron nitride; Polymer composite; Double percolated networks; Thermal and insolated properties; NANOTUBES TERNARY COMPOSITES; POLYMER COMPOSITES; ELASTOMER COMPOSITES; THERMOPLASTIC COMPOSITES; SYNERGISTIC IMPROVEMENT; SILVER NANOPARTICLES; SEGREGATED STRUCTURE; NANOSHEETS; ENHANCEMENT; EPOXY;
D O I：
10.1016/j.compscitech.2017.09.032
中图分类号：
TB33 [复合材料];
学科分类号：
摘要：
In the present study, high thermally conductive and electrically insulated polymer composites containing modified dense graphene foam (MGF) and modified hexagonal boron nitride (M-h-BN) via polydopamine (PDA) coating and 3-aminopropyltriethoxysilane (APTS) grafting were manufactured and studied. Due to the double percolated networks built by MGF and M-h-BN, the polydimethylsiloxane (PDMS) matrix composite has high thermal conductivity of 23.45Wm(-1)K(-1) and 2.11Wm(-1)K(-1) in in-plane and out-of-plane directions, respectively. In addition, an insulated layer of M-h-BN/PDMS can be introduced onto both sides of composite sample with the help of infiltration technique, which results in a high breakdown strength of 4.5 kV/mm. Owing to the excellent comprehensive properties, the M-h-BN/MGF/PDMS composite has a promising application in heat management field of the microelectronic industry. (C) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码：243 / 253
页数：11
相关论文
共 58 条
[1]   In situ formation of a cellular graphene framework in thermoplastic composites leading to superior thermal conductivity [J].
Alam, Fakhr E. ;
Dai, Wen ;
Yang, Minghui ;
Du, Shiyu ;
Li, Xinming ;
Yu, Jinhong ;
Jiang, Nan ;
Lin, Cheng-Te .
JOURNAL OF MATERIALS CHEMISTRY A, 2017, 5 (13) :6164-6169
[2]   Review of thermal conductivity in composites: Mechanisms, parameters and theory [J].
Burger, N. ;
Laachachi, A. ;
Ferriol, M. ;
Lutz, M. ;
Toniazzo, V. ;
Ruch, D. .
PROGRESS IN POLYMER SCIENCE, 2016, 61 :1-28
[3]   Largely improved thermal conductivity of HDPE/expanded graphite/carbon nanotubes ternary composites via filler network-network synergy [J].
Che, Junjin ;
Wu, Kai ;
Lin, Yunjie ;
Wang, Ke ;
Fu, Qiang .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2017, 99 :32-40
[4]   Thermal conductivity of polymer-based composites: Fundamentals and applications [J].
Chen, Hongyu ;
Ginzburg, Valeriy V. ;
Yang, Jian ;
Yang, Yunfeng ;
Liu, Wei ;
Huang, Yan ;
Du, Libo ;
Chen, Bin .
PROGRESS IN POLYMER SCIENCE, 2016, 59 :41-85
[5]   Thermal properties of epoxy resin based thermal interfacial materials by filling Ag nanoparticle-decorated graphene nanosheets [J].
Chen, Lifei ;
Zhao, Panfeng ;
Xie, Huaqing ;
Yu, Wei .
COMPOSITES SCIENCE AND TECHNOLOGY, 2016, 125 :17-21
[6]   Three-dimensional carbon nanotube based polymer composites for thermal management [J].
Cho, Er-Chieh ;
Chang-Jian, Cai-Wan ;
Hsiao, Yu-Sheng ;
Lee, Kuen-Chan ;
Huang, Jen-Hsien .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2016, 90 :678-686
[7]   Insulating polymer nanocomposites with high-thermal-conduction routes via linear densely packed boron nitride nanosheets [J].
Cho, Hong-Baek ;
Nakayama, Tadachika ;
Suematsu, Hisayuki ;
Suzuki, Tsuneo ;
Jiang, Weihua ;
Niihara, Koichi ;
Song, Eunpil ;
Eom, Nu Si A. ;
Kim, Seil ;
Choa, Yong-Ho .
COMPOSITES SCIENCE AND TECHNOLOGY, 2016, 129 :205-213
[8]   Boron nitride filled epoxy with improved thermal conductivity and dielectric breakdown strength [J].
Donnay, Martin ;
Tzavalas, Spiros ;
Logakis, Emmanuel .
COMPOSITES SCIENCE AND TECHNOLOGY, 2015, 110 :152-158
[9]   Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application [J].
Fang, Haoming ;
Bai, Shu-Lin ;
Wong, Ching Ping .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2017, 100 :71-80
[10]   Three-Dimensional Graphene Foam-Filled Elastomer Composites with High Thermal and Mechanical Properties [J].
Fang, Haoming ;
Zhao, Yunhong ;
Zhang, Yafei ;
Ren, Yanjuan ;
Baio, Shu-Lin .
ACS APPLIED MATERIALS & INTERFACES, 2017, 9 (31) :26447-26459
123456