GaN Power ICs: Reviewing Strengths, Gaps, and Future Directions

被引:25
作者
Trescases, O. [1 ]
Murray, S. K. [1 ]
Jiang, W. L. [1 ]
Zaman, M. S. [1 ]
机构
[1] Univ Toronto, Edward S Rogers Sr Dept Elect & Comp Engn, Toronto, ON, Canada
来源
2020 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2020年
基金
加拿大自然科学与工程研究理事会;
关键词
D O I
10.1109/IEDM13553.2020.9371918
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reviews monolithic GaN integration for power ICs, focusing on current technological capabilities. We highlight key opportunities for integrating low-voltage circuits alongside power devices to support converter operation. Simulations and experimental results from the imec 200V GaNon-SOI and ON Semiconductor 650V GaN-on-Si processes provide quantitative insights for digital and analog circuitry.
引用
收藏
页数:4
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