Modeling thermal behavior of chills during solidification of Al-Cu-Si alloy

被引:0
|
作者
Prabhu, KN [1 ]
Prabhu, NN [1 ]
机构
[1] Karnataka Reg Engn Coll, Srinivasanagar, Karnataka, India
关键词
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
The hear transfer in chills through which heat is extracted uniformly during the solidification of Al-Cu-Si alloy was investigated. The aim of the work is to estimate the localized chill-casting interfacial heat flux for various casting conditions, using measured values of temperatures at locations within the chill material, along with an "a priori" knowledge of the thermophysical proper-ties of the chill. The effect of chill location on interfacial heat flux was also investigated. A portable data logger was used for accessing the thermal history inside the casting and the chill. The heat diffusivity (root k rho Cp), thermal diffusivity (alpha = k/rho Cp) and thickness of the chill (d) were found to be important parameters controlling the heat flow across the casting-chill interface. The peak chill surface temperature was observed to decrease with increase in (d. alpha). The local solidification time decreased exponentially with increase in (d.root k rho Cp). The peak heat flux was modeled as an exponential function of the product of chill thickness and heat diffusivity (d. root k rho Cp). The time of occurrence of peak heat flux was modeled as power function of the product of chill thickness and thermal diffusivity (d.alpha). A fifth degree polynomial equation was used to describe the variation of normalized heat flux with time after occurrence of peak heat flux. The heat flux model was validated. The experimentally measured and simulated temperatures inside the chill and casting, were found to be in good agreement. All the castings were subjected to microstructure analysis. It was observed that volumetric heat capacity of the chill material had a significant effect on the secondary dendrite arm spacing (lambda(2)) of the casting.
引用
收藏
页码:707 / 713
页数:7
相关论文
共 50 条
  • [1] Microstructural Development in a Ternary Al-Cu-Si Alloy during Transient Solidification
    Ferreira, I. L.
    Moutinho, D. J.
    Gomes, L. G.
    Rocha, O. L.
    Goulart, P. R.
    Garcia, A.
    ADVANCED MATERIALS FORUM V, PT 1 AND 2, 2010, 636-637 : 643 - +
  • [2] SOLIDIFICATION AND POST SOLIDIFICATION BEHAVIOR OF COMPLEX-IRREGULAR SI IN AL RICH AL-CU-SI ALLOYS
    SCHNAKE, W
    NUNEZ, L
    ACTA METALLURGICA, 1986, 34 (03): : 465 - 474
  • [3] Thermal Parameters, Microstructure and Porosity During Transient Solidification of Ternary Al-Cu-Si Alloys
    Moutinho, Daniel J.
    Gomes, Laercio G.
    Rocha, Otavio L.
    Ferreira, Ivaldo L.
    Garcia, Amauri
    ADVANCED MATERIALS FORUM VI, PTS 1 AND 2, 2013, 730-732 : 883 - +
  • [4] Solidification and microstructural formation of a ternary eutectic Al-Cu-Si cast alloy
    Awe S.A.
    Journal of King Saud University - Engineering Sciences, 2021, 33 (08) : 569 - 580
  • [5] Microstructure and Tensile Properties of Al-Cu-Si Alloy with Different Solidification Pressures
    Ouyang, X. X.
    Zhao, H. D.
    Zhang, K. W.
    Li, Y. Y.
    ADVANCES IN MATERIALS MANUFACTURING SCIENCE AND TECHNOLOGY XIII, VOL II: MODERN DESIGN THEORY AND METHODOLOGY, MEMS AND NANOTECHNOLOGY, AND MATERIAL SCIENCE AND TECHNOLOGY IN MANUFACTURING, 2009, 628-629 : 593 - 598
  • [6] Microstructures observed during directional solidification along the univariant eutectic reaction in a ternary Al-Cu-Si alloy
    de Wilde, J
    Froyen, L
    SOLIDIFICATION AND GRAVITY IV, 2006, 508 : 51 - 56
  • [7] Rapid solidification of acoustically levitated Al-Cu-Si eutectic alloy under laser irradiation
    Yan Na
    Geng Delu
    Hong ZhenYu
    Wei BingBo
    CHINESE SCIENCE BULLETIN, 2011, 56 (09): : 912 - 918
  • [8] Casting/mold thermal contact heat transfer during solidification of Al-Cu-Si alloy (LM 21) plates in thick and thin molds
    Prabhu, KN
    Chowdary, B
    Venkataraman, N
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2005, 14 (05) : 604 - 609
  • [9] Rapid solidification of acoustically levitated Al-Cu-Si eutectic alloy under laser irradiation
    YAN Na GENG DeLu HONG ZhenYu WEI BingBo Department of Applied Physics Northwestern Polytechnical University Xian China
    Chinese Science Bulletin, 2011, 56 (09) : 914 - 920
  • [10] Rapid solidification of undercooled Al-Cu-Si eutectic alloys
    RUAN Ying & WEI BingBo Department of Applied Physics
    Science Bulletin, 2009, (01) : 53 - 58