Measurement of deformation of epoxy resin plates with an embedded SMA wire using digital image correlation

The deformation of the surface of epoxy resin plates with an embedded linear shape-memory alloy (SMA) wire as an actuator in smart structure members is measured as a function of the duration of the supply of electric current to the SMA wire, using a digital image correlation technique. Results show that the two-dimensional deformation of the plate surface can be measured, and that the maximum deformation of the plate surface can be obtained on both sides of a crack and increases with the duration of the current supply. Therefore, the deformation of the plate surface measured using the digital image correlation technique suggests the possibility of its application in the prediction of crack closure in. epoxy resin plates with embedded SMA wires heated by supplying electric current.