Recrystallization during the discontinuous precipitation of β-Sn in 95Pb-5Sn and 85Pb-15Sn solder alloys

被引:6
作者
Kim, JS
Kang, MS
Lee, SB
机构
[1] Hoseo Univ, Dept Mat Sci & Engn, Chungnam 336795, South Korea
[2] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Taejon 305701, South Korea
关键词
D O I
10.1016/S1359-6462(98)00093-1
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
[No abstract available]
引用
收藏
页码:1677 / 1684
页数:8
相关论文
共 50 条
[41]   DENSITIES OF PB-SN ALLOYS DURING SOLIDIFICATION [J].
POIRIER, DR .
METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1988, 19 (09) :2349-2354
[42]   The Fatigue Life Analysis of the VCSEL with Sn/Pb and Sn/Ag/Cu Solder [J].
Qiu, Bo-Rong ;
Lin, Cheng-Han ;
Lin, Ah-Der ;
Hsu, Chao-Ming .
PROCEEDINGS OF THE 2ND INTERNATIONAL CONFERENCE ON INTELLIGENT TECHNOLOGIES AND ENGINEERING SYSTEMS (ICITES2013), 2014, 293 :111-119
[43]   Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder [J].
Islam, RA ;
Wu, BY ;
Alam, MO ;
Chan, YC ;
Jillek, W .
JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 392 (1-2) :149-158
[44]   The potential of Pb-Sn-alloys [J].
Muzaffar, SD .
ZEITSCHRIFT FUR ANORGANISCHE UND ALLGEMEINE CHEMIE, 1923, 126 (03) :254-256
[45]   THERMODYNAMIC INVESTIGATION OF THE TERNARY K-PB-SN AND RB-PB-SN ALLOYS [J].
TUMIDAJSKI, PJ .
CANADIAN JOURNAL OF CHEMISTRY-REVUE CANADIENNE DE CHIMIE, 1991, 69 (03) :458-461
[46]   Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow [J].
Alam, MO ;
Chan, YC ;
Hung, KC .
JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (10) :1117-1121
[47]   ETA-CU6SN5 PRECIPITATES IN CU/PB-SN SOLDER JOINTS [J].
FELTON, LE ;
RAJAN, K ;
FICALORA, PJ ;
SINGH, P .
SCRIPTA METALLURGICA ET MATERIALIA, 1991, 25 (10) :2329-2333
[48]   INVESTIGATIONS OF DIFFUSION MECHANISM IN QUASIBINARY SEMICONDUCTOR ALLOYS (PB,SN)TE AND (PB,SN)SE [J].
LEUTE, V ;
SCHMIDTKE, H .
BERICHTE DER BUNSEN-GESELLSCHAFT-PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 1975, 79 (11) :1134-1140
[49]   Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow [J].
M. O. Alam ;
Y. C. Chan ;
K. C. Hung .
Journal of Electronic Materials, 2002, 31 :1117-1121
[50]   Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys [J].
Tucker, J. P. ;
Chan, D. K. ;
Subbarayan, G. ;
Handwerker, C. A. .
JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (03) :596-610