Determination of the residual stress in texture Cu-Ni-Si-Co alloy with HEXRD

This work uses high-energy synchrotron X-ray diffraction (HEXRD), atomic force microscope (AFM), nanoindentation and EBSD technology to explore a new method for measuring residual stress in strong R {124} 211 texture alloys, and the distribution of residual stress and Young's modulus in different crystal orientations. Compared with the traditional Voigt and Reuss model, for the textured Cu-Ni-Si-Co alloy, a local Voigt and Reuss inter-grain interaction model based on HEXRD diffraction technology is established, which can more accurately characterize the residual stress of superficial layer (230 mu m). The local stress model provides a new X-ray diffraction method for testing the residual stress of textured materials. Aiming at the textured Cu-Ni-Si-Co alloy with compressive stress, the quasi-in-situ method combining EBSD and nanoindentation is used to characterize the residual stress of different crystal orientations in the microdomain. The hard orientation [1 1 1] grain direction has the highest residual stress, and the soft orientation [100] grain direction has the lowest residual stress, and the residual compressive stress in the hard orientation is about twice that of the soft orientation. In addition, the Young's modulus of the material is also the largest on [111] hard-oriented grains and the smallest on [100] softoriented grains.