The Importance of Wafer Edge in Wafer Bonding Technologies and Related Wafer Edge Engineering Methods

被引：4
作者：
Knechtel, Roy [1 ]
Schwarz, Uwe [2 ]
Dempwolf, Sophia [2 ]
Klingner, Holger [2 ]
Nevin, Andy [2 ]
Lindemann, Gunnar [2 ]
Schikowski, Marc [3 ]
机构：
[1] Schmalkalden Univ Appl Sci Autonomous Intelligent, Chair Carl Zeiss Fdn, D-98574 Schmalkalden, Germany
[2] X FAB MEMS Foundry GmbH, Haarbergstr 67, D-99097 Erfurt, Germany
[3] X FAB MEMS Foundry Itzehoe GmbH, Fraunhoferstr 1, D-25524 Itzehoe, Germany
来源：
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | 2021年 / 10卷 / 07期
关键词：
Wafer Bonding; Wafer Edge; Semiconductor direct bonding; Glass Frit Bonding; Edge Trimming; Wafer Edge Engineering; Grinding;
D O I：
10.1149/2162-8777/ac0f14
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Wafer bonding is an important process step in microsystem technologies for processing engineered substrates and for capping. Usually, the work and literature are focused on the bonding of the main wafer area. However, in recent years MEMS technologies have become more complex, with more process steps after wafer bonding. Accordingly, the wafer edge is becoming more and more important, and must be engineered. Methods for realizing this are discussed in this paper.
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收藏
页数：11
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